The DIP-ADAPTER-EVM speeds up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The TPS63020EVM-487 evaluation module is a fully assembled and tested circuit for evaluating the TPS63020 Buck-Boost Converter with 4A Switch. The TPS63020EVM-487 operates from a 1.8V to 5.5V supply and provides a 3.3V output.
The OPT8241 3D Time-of-Flight (ToF) Sensor Evaluation Module is the official evaluation module for the second-generation 3D Time-of-Flight (3D ToF) sensor from Texas Instruments. The Camera Development Kit (CDK) showcases the high-performance QVGA (320 x 240) resolution 3D ToF OPT8241 with its companion ToF controller OPT9221.
The ADS1299EEGFE-PDK is a demonstration kit for the ADS1299, an eight channel, simultaneous sampling, 24-bit, delta-sigma (Δ Σ) analog-to-digital converter (ADC) with a built-in programmable gain amplifier (PGA), internal reference, and an on-board oscillator.
LMX2592EVM High Performance, Wideband Frequency PLLatinum RF Synthesizer With Integrated VCO This Evaluation Module is for the LMX2592, which outputs very high frequency signals with industry leading phase noise. The integrated VCO allows minimal discrete external components to design. The PCB is optimized for performance as well as designed for easy customization of the loop filter. An LED is designed for quick visual check on the PLL lock status. With an on-board oscillator, setup process only requires a 3.3V power supply and an included USB2ANY module.
The TPS7A30-49EVM-567 is a fully assembled and tested circuit for evaluating the TPS7A3001 and TPS7A4901 low-dropout linear regulators in the DGN (3mm x 5mm MSOP-8) package. The TPS7A30-49EVM-567 includes two independent circuits with outputs of -15V and +15V, respectively.
The TM4C123G LaunchPad Evaluation Kit is a low-cost evaluation platform for ARM Cortex-M4F based microcontrollers from Texas Instruments. The design of the TM4C123G LaunchPad highlights the TM4C123GH6PM microcontroller with a USB 2.0 device interface and hibernation module.
The TM4C1294 Connected LaunchPad Evaluation Kit is a low-cost development platform for ARM® Cortex-M4F-based microcontrollers. The Connected LaunchPad design highlights the TM4C1294NCPDT MCU with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation and a multitude of simultaneous serial connectivity.
The SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack plug-in module is the quick and easy way to add Bluetooth low energy to your LaunchPad™ development kit. Simply plug the CC2650 module BoosterPack kit into the MSP432™ microcontroller (MCU) LaunchPad kit to get started
The TPS65982-EVM is a complete reference design for USB Type-C and Power Delivery applications. It allows the user to develop various power profiles and alternate modes such as DisplayPort and debug existing USB Type-C and Power Delivery systems.
The TPS92515HVEVM-749 is a fully assembled and tested LED driver. It can be used to power a single string of series connected LEDs. Various dimming configurations can be tested using this EVM: Analog Dimming, PWM Dimming, Shunt FET dimming.
The MSP-EXP430FR4133 LaunchPad development kit is an easy-to-use Evaluation Module (EVM) for the MSP430FR4133 microcontroller. It contains everything needed to start developing on the MSP430 Ultra-low-power (ULP) FRAM-based microcontroller (MCU) platform, including on-board emulation for programming, debugging and energy measurements.
The BOOSTXL-DRV8305EVM is a 15A, 3-phase brushless DC drive stage based on the DRV8305 motor gate driver and CSD18540Q5B NexFET™ power MOSFET. The module has individual DC bus and phase voltage sense as well as individual low-side current shunt sense for sensorless BLDC algorithms. The module supplies MCU 3.3V power with the LMR16006 0.6A step down buck regulator.
The 430BOOST-ADS1118 Booster Pack provides a quick and low-cost solution to evaluate and develop the ADS1118 for temperature measurement applications using type K thermocouples. This booster pack comes with preloaded firmware for the MSP430G2553 device. The software also provides fully commented source code for users to get started developing applications.
The FDC2214EVM Evaluation Module demonstrates the use of capacitive sensing technology to detect the presence of any target object, which can be either conductive or non-conductive. The module includes two example PCB capacitive sensors that connect to two of the four channels of the FDC2214. An MSP430 microcontroller is used to interface the FDC to a host computer