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Details for "LMR33630BQRNXRQ1"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LMR33630BQRNXRQ1 CU SN Level-2-260C-1 YEAR Ext-Mfg RNX | 12 3x2x0.9 13.300000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Lead Frame
Copper and Its Alloys Copper 7440-50-8 4.579882 97.444277 974443 34.343181 343432
Copper and Its Alloys Iron 7439-89-6 0.110398 2.348893 23489 0.827842 8278
Copper and Its Alloys Phosphorus 7723-14-0 0.003860 0.082130 821 0.028940 289
Zinc and Its Alloys Zinc 7440-66-6 0.005861 0.124702 1247 0.043950 439
Sub-Total     4.700001 100 1000000 35.243918 352439
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.060000 100.000000 1000000 0.450000 4499
Sub-Total     0.060000 100 1000000 0.450000 4499
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 5.263863 90.999997 910000 39.472153 394722
Other Plastics and Rubber Carbon Black 1333-86-4 0.028922 0.499994 5000 0.216878 2169
Thermoplastics Epoxy 85954-11-6 0.491680 8.500010 85000 3.686960 36870
Sub-Total     5.784465 100 1000000 43.375993 433760
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 2.655392 100.000000 1000000 19.912000 199120
Sub-Total     2.655392 100 1000000 19.912000 199120
Solder Bump
Copper and Its Alloys Copper 7440-50-8 0.119648 88.119665 881197 0.897205 8972
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.015316 11.280095 112801 0.114850 1149
Precious Metals Silver 7440-22-4 0.000815 0.600240 6002 0.006111 61
Sub-Total     0.135779 100 1000000 1.018167 10182

Total

    13.335637     100 1000000

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