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Details for "LMP90097MH/NOPB"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LMP90097MH/NOPB CU SN Level-3-260C-168 HR Texas Instruments Electronics PWP | 28 9.7 x 4.4 x 1.0 114.300000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.000001 0.000333 3 0.000001 0
Copper and Its Alloys Iron 7439-89-6 0.000001 0.000333 3 0.000001 0
Magnesium and Its Alloys Magnesium 7439-95-4 0.000001 0.000333 3 0.000001 0
Other Nonferrous Metals and Alloys Beryllium 7440-41-7 0.000003 0.001000 10 0.000003 0
Other Nonferrous Metals and Alloys Calcium 7440-70-2 0.000004 0.001334 13 0.000003 0
Precious Metals Gold 7440-57-5 0.299897 99.995665 999957 0.262295 2623
Precious Metals Silver 7440-22-4 0.000003 0.001000 10 0.000003 0
Sub-Total     0.299910 100 1000000 0.262306 2623
Die Attach Adhesive
Other Plastics and Rubber Epoxy Resin 25928-94-3 0.155000 25.000000 250000 0.136000 1356
Precious Metals Silver 7440-22-4 0.465000 75.000000 750000 0.407000 4067
Sub-Total     0.620000 100 1000000 0.542000 5423
Lead Frame
Copper and Its Alloys Copper 7440-50-8 40.057290 94.900000 949000 35.034740 350347
Magnesium and Its Alloys Magnesium 7439-95-4 0.063315 0.150000 1500 0.055376 554
Nickel and Its Alloys Nickel 7440-02-0 1.249416 2.960000 29600 1.092759 10928
Other Inorganic Materials Silicon 7440-21-3 0.270144 0.640000 6400 0.236272 2363
Precious Metals Silver 7440-22-4 0.569835 1.350000 13500 0.498387 4984
Sub-Total     42.210000 100 1000000 36.917535 369175
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 3.000000 100.000000 1000000 3.000000 26238
Sub-Total     3.000000 100 1000000 3.000000 26238
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 55.365326 88.999999 890000 48.423392 484234
Other Nonferrous Metals and Alloys Metal Hydroxide Trade Secret 1.866247 3.000000 30000 1.632249 16322
Thermoplastics Epoxy 85954-11-6 4.976659 8.000001 80000 4.352665 43527
Sub-Total     62.208232 100 1000000 54.408306 544083
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 5.997769 100.000000 1000000 5.245744 52457
Sub-Total     5.997769 100 1000000 5.245744 52457

Total

    114.335911     100 1000000

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