Quality & reliability


Material content search

Details for "DS100DF410SQ/NOPB" ACTIVE

Choose a download method for component information:

Or

Current Product Information

TI part number Lead finish/Ball material MSL rating/Peak reflow Assembly site Package | Pins Package body size (mm) Total device mass (mg) *
DS100DF410SQ/NOPB SN Level-3-260C-168 HR Texas Instruments Electronics RHS | 48 7 x 7 x 0.8 144.500000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS REACH Green status IEC 62474 DB
Yes Yes Yes Yes

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.581488 98.166121 981661 0.402360 4024
Nickel and Its Alloys Nickel 7440-02-0 0.000003 0.000506 5 0.000002 0
Not Categorized Proprietary Materials 0.000041 0.006922 69 0.000028 0
Precious Metals Gold 7440-57-5 0.000142 0.023972 240 0.000098 1
Precious Metals Palladium 7440-05-3 0.010662 1.799946 17999 0.007378 74
Precious Metals Silver 7440-22-4 0.000015 0.002532 25 0.000010 0
Sub-Total     0.592351 100 1000000 0.409877 4099
Die Attach Adhesive
Precious Metals Silver 7440-22-4 1.069160 74.999980 750000 0.739800 7398
Thermoplastics Epoxy 85954-11-6 0.356387 25.000018 250000 0.246602 2466
Sub-Total     1.425547 100 1000000 0.986405 9864
Lead Frame
Copper and Its Alloys Copper 7440-50-8 79.220160 96.000000 960000 54.816290 548163
Copper and Its Alloys Iron 7439-89-6 2.145546 2.600000 26000 1.484608 14846
Copper and Its Alloys Phosphorus 7723-14-0 0.123782 0.150001 1500 0.085651 857
Other Nonferrous Metals and Alloys Lead 7439-92-1 0.024756 0.030000 300 0.017130 171
Precious Metals Silver 7440-22-4 0.841714 1.020000 10200 0.582423 5824
Zinc and Its Alloys Zinc 7440-66-6 0.165042 0.200000 2000 0.114201 1142
Sub-Total     82.521000 100 1000000 57.100305 571003
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.482000 100.000000 1000000 0.334000 3335
Sub-Total     0.482000 100 1000000 0.334000 3335
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 49.839362 90.500000 905000 34.486285 344863
Thermoplastics Epoxy 85954-11-6 5.231756 9.500000 95000 3.620107 36201
Sub-Total     55.071118 100 1000000 38.106393 381064
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 4.427353 100.000000 1000000 3.063501 30635
Sub-Total     4.427353 100 1000000 3.063501 30635

Total

    144.519369     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support