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Details for "LM3530UMX-40B/NOPB"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LM3530UMX-40B/NOPB SNAGCU Level-1-260C-UNLIM Texas Instruments Electronics YFZ | 12 1.25x1.65x.304 2.200000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Active Side Coating
Other Organic Materials Benzocyclobutene 694-87-1 0.030000 100.000000 1000000 1.350000 13535
Sub-Total     0.030000 100 1000000 1.350000 13535
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 1.464126 100.000000 1000000 66.057850 660578
Sub-Total     1.464126 100 1000000 66.057850 660578
Solder Bump
Copper and Its Alloys Copper 7440-50-8 0.003612 0.500066 5001 0.162965 1630
Nickel and Its Alloys Nickel 7440-02-0 0.000361 0.049979 500 0.016287 163
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.709663 98.249906 982499 32.018291 320183
Precious Metals Silver 7440-22-4 0.008668 1.200049 12000 0.391079 3911
Sub-Total     0.722304 100 1000000 32.588622 325886

Total

    2.216430     100 1000000

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