Quality & reliability


Material content search

Details for "LM25116MH/NOPB"

Choose a download method for component information:

Or

Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LM25116MH/NOPB CU SN Level-1-260C-UNLIM Texas Instruments Electronics PWP | 20 6.5 x 4.4 x 1.0 71.400000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.208393 99.060227 990602 0.291690 2917
Nickel and Its Alloys Nickel 7440-02-0 0.000001 0.000475 5 0.000001 0
Not Categorized Proprietary Materials 0.000015 0.007130 71 0.000021 0
Precious Metals Gold 7440-57-5 0.000021 0.009982 100 0.000029 0
Precious Metals Palladium 7440-05-3 0.001935 0.919808 9198 0.002708 27
Precious Metals Silver 7440-22-4 0.000005 0.002377 24 0.000007 0
Sub-Total     0.210370 100 1000000 0.294457 2945
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.836527 75.000022 750000 1.170894 11709
Thermoplastics Epoxy 85954-11-6 0.278842 24.999978 250000 0.390298 3903
Sub-Total     1.115369 100 1000000 1.561192 15612
Lead Frame
Copper and Its Alloys Copper 7440-50-8 20.171560 94.210580 942106 28.234310 282343
Magnesium and Its Alloys Magnesium 7439-95-4 0.032114 0.149987 1500 0.044950 450
Nickel and Its Alloys Nickel 7440-02-0 0.629425 2.939708 29397 0.881012 8810
Other Inorganic Materials Silicon 7440-21-3 0.137018 0.639938 6399 0.191785 1918
Precious Metals Silver 7440-22-4 0.441025 2.059792 20598 0.617307 6173
Sub-Total     21.411142 100 1000000 29.969365 299694
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 3.000000 100.000000 1000000 4.000000 41991
Sub-Total     3.000000 100 1000000 4.000000 41991
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 37.155419 89.000000 890000 52.006770 520068
Other Nonferrous Metals and Alloys Metal Hydroxide Trade Secret 1.252430 3.000000 30000 1.753040 17530
Thermoplastics Epoxy 85954-11-6 3.339813 8.000000 80000 4.674766 46748
Sub-Total     41.747662 100 1000000 58.434573 584346
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 3.958885 100.000000 1000000 5.541286 55413
Sub-Total     3.958885 100 1000000 5.541286 55413

Total

    71.443428     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support