Quality & reliability


Material content search

Details for "LP38859SX-1.2/NOPB"

Choose a download method for component information:

Or

Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LP38859SX-1.2/NOPB CU SN Level-3-245C-168 HR Texas Instruments Electronics KTT | 5 10.2 x 9 x 4.5 1,600.700000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
ROHS Exempt Y N Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals Gold 7440-57-5 0.962804 100.000000 1000000 0.060151 602
Sub-Total     0.962804 100 1000000 0.060151 602
Die Attach Adhesive
Other Nonferrous Metals and Alloys Lead 7439-92-1 1.823339 95.500025 955000 0.113912 1139
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.038185 1.999995 20000 0.002386 24
Precious Metals Silver 7440-22-4 0.047731 2.499980 25000 0.002982 30
Sub-Total     1.909255 100 1000000 0.119280 1193
Lead Frame
Copper and Its Alloys Copper 7440-50-8 794.947566 99.600040 996000 49.663858 496639
Copper and Its Alloys Phosphorus 7723-14-0 0.079806 0.009999 100 0.004986 50
Other Nonferrous Metals and Alloys Tin 7440-31-5 1.197090 0.149990 1500 0.074790 748
Precious Metals Silver 7440-22-4 1.915344 0.239976 2400 0.119660 1197
Sub-Total     798.139806 100 1000000 49.863291 498633
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 6.860000 100.000000 1000000 0.430000 4286
Sub-Total     6.860000 100 1000000 0.430000 4286
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 703.688122 89.000000 890000 43.962481 439625
Other Nonferrous Metals and Alloys Metal Hydroxide Trade Secret 23.719824 3.000000 30000 1.481881 14819
Thermoplastics Epoxy 85954-11-6 63.252865 8.000000 80000 3.951684 39517
Sub-Total     790.660811 100 1000000 49.396046 493960
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 2.123408 100.000000 1000000 0.132659 1327
Sub-Total     2.123408 100 1000000 0.132659 1327

Total

    1,600.656084     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support