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Details for "LMR10520XSDE/NOPB"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LMR10520XSDE/NOPB CU SN Level-3-260C-168 HR Texas Instruments Electronics NGG | 6 3 x 3 x 0.8 19.600000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Iron 7439-89-6 0.000001 0.000610 6 0.000005 0
Magnesium and Its Alloys Magnesium 7439-95-4 0.000001 0.000610 6 0.000005 0
Other Nonferrous Metals and Alloys Beryllium 7440-41-7 0.000002 0.001220 12 0.000010 0
Other Nonferrous Metals and Alloys Calcium 7440-70-2 0.000005 0.003050 30 0.000025 0
Other Nonferrous Metals and Alloys Yttrium 7440-65-5 0.000005 0.003050 30 0.000025 0
Precious Metals Gold 7440-57-5 0.163925 99.989630 999896 0.835212 8352
Precious Metals Silver 7440-22-4 0.000003 0.001830 18 0.000015 0
Sub-Total     0.163942 100 1000000 0.835299 8353
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.220006 75.000085 750001 1.120950 11209
Thermoplastics Epoxy 85954-11-6 0.073335 24.999915 249999 0.373648 3736
Sub-Total     0.293341 100 1000000 1.494598 14946
Lead Frame
Copper and Its Alloys Copper 7440-50-8 7.455156 95.790423 957904 37.984663 379847
Copper and Its Alloys Iron 7439-89-6 0.183655 2.359762 23598 0.935738 9357
Copper and Its Alloys Phosphorus 7723-14-0 0.002335 0.030002 300 0.011897 119
Precious Metals Silver 7440-22-4 0.132294 1.699830 16998 0.674049 6740
Zinc and Its Alloys Zinc 7440-66-6 0.009338 0.119983 1200 0.047578 476
Sub-Total     7.782778 100 1000000 39.653925 396539
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.466000 100.000000 1000000 2.374000 23743
Sub-Total     0.466000 100 1000000 2.374000 23743
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 9.058738 90.500002 905000 46.155052 461551
Thermoplastics Epoxy 85954-11-6 0.950917 9.499998 95000 4.845004 48450
Sub-Total     10.009655 100 1000000 51.000056 510001
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 0.911037 100.000000 1000000 4.641812 46418
Sub-Total     0.911037 100 1000000 4.641812 46418

Total

    19.626753     100 1000000

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