Quality & reliability


Material content search

Details for "LM321MFX"

Choose a download method for component information:

Or

Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LM321MFX CU SNPB Level-1-260C-UNLIM Texas Instruments Electronics DBV | 5 2.9 x 1.6 x 1.45 18.100000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
N Y N N

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.013534 100.000000 1000000 0.074679 747
Sub-Total     0.013534 100 1000000 0.074679 747
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.121935 75.000000 750000 0.672821 6728
Thermoplastics Epoxy 85954-11-6 0.040645 25.000000 250000 0.224274 2243
Sub-Total     0.162580 100 1000000 0.897095 8971
Lead Frame
Copper and Its Alloys Copper 7440-50-8 5.436408 96.509995 965100 29.997383 299974
Copper and Its Alloys Iron 7439-89-6 0.134065 2.379993 23800 0.739753 7398
Copper and Its Alloys Phosphorus 7723-14-0 0.001690 0.030000 300 0.009330 93
Precious Metals Silver 7440-22-4 0.054077 0.960004 9600 0.298390 2984
Zinc and Its Alloys Zinc 7440-66-6 0.006760 0.120010 1200 0.037300 373
Sub-Total     5.633000 100 1000000 31.082152 310822
Lead Frame Plating
Other Nonferrous Metals and Alloys Lead 7439-92-1 0.259000 37.000000 370000 1.429000 14291
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.441000 63.000000 630000 2.433000 24334
Sub-Total     0.700000 100 1000000 3.863000 38625
Mold Compound
Other Inorganic Materials Silica 7631-86-9 9.789611 88.700004 887000 54.017783 540178
Other Nonferrous Metals and Alloys Metal Hydroxide Trade Secret 0.331103 3.000000 30000 1.826983 18270
Other Plastics and Rubber Carbon Black 1333-86-4 0.033110 0.300000 3000 0.182700 1827
Thermoplastics Epoxy 85954-11-6 0.882941 7.999998 80000 4.871952 48720
Sub-Total     11.036765 100 1000000 60.899415 608994
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 0.577062 100.000000 1000000 3.184152 31842
Sub-Total     0.577062 100 1000000 3.184152 31842

Total

    18.122941     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support