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Details for "BQ2002TSNG4"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
BQ2002TSNG4 CU NIPDAU Level-1-260C-UNLIM TI AGUASCALIENTES D | 8 3.91x4.9x1.58 108.300000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.036890 100.000000 1000000 0.034070 341
Sub-Total     0.036890 100 1000000 0.034070 341
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.259363 78.999903 789999 0.239558 2396
Thermoplastics Epoxy 85954-11-6 0.068945 21.000097 210001 0.063680 637
Sub-Total     0.328308 100 1000000 0.303239 3032
Lead Frame
Copper and Its Alloys Copper 7440-50-8 45.310704 97.050000 970500 41.850803 418508
Copper and Its Alloys Iron 7439-89-6 1.213888 2.600000 26000 1.121196 11212
Copper and Its Alloys Phosphorus 7723-14-0 0.070032 0.150000 1500 0.064684 647
Zinc and Its Alloys Zinc 7440-66-6 0.093376 0.200000 2000 0.086246 862
Sub-Total     46.688000 100 1000000 43.122930 431229
Lead Frame Plating
Nickel and Its Alloys Nickel 7440-02-0 0.154094 95.119753 951198 0.142327 1423
Precious Metals Gold 7440-57-5 0.001264 0.780247 7802 0.001167 12
Precious Metals Palladium 7440-05-3 0.006642 4.100000 41000 0.006135 61
Sub-Total     0.162000 100 1000000 0.149630 1496
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 52.676342 88.000001 880000 48.654005 486540
Other Plastics and Rubber Carbon Black 1333-86-4 0.179578 0.299999 3000 0.165866 1659
Other Plastics and Rubber Organic Phosphorus 1330-78-5 0.329227 0.550000 5500 0.304087 3041
Thermoplastics Epoxy 85954-11-6 6.674332 11.150000 111500 6.164684 61647
Sub-Total     59.859479 100 1000000 55.288642 552886
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 1.192550 100.000000 1000000 1.101490 11015
Sub-Total     1.192550 100 1000000 1.101490 11015

Total

    108.267227     100 1000000

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