Supplier Name: Texas Instruments Inc. (DUNS# 00-732-1904)
Contact Info: ti.com/supportform
Form/Declaration Type: Distribute - RoHS and IEC 62474 DB
Created on: 10/22/2019

Results for "OPA4188AIPW"

Summary Results
Search part number TI part number RoHS status REACH status Green status IEC 62474 DB Package | pins Assembly site Lead/ball finish MSL/reflow ratings Mass (mg)***
OPA4188AIPW OPA4188AIPW Y Y Y Y PW ** | 14 Ext-Mfg CU NIPDAU Level-2-260C-1 YEAR 57.200000
OPA4188AIPW OPA4188AIPWR Y Y Y Y PW ** | 14 Ext-Mfg CU NIPDAU Level-2-260C-1 YEAR 57.200000


*Part Number
No material contents are available for this part.
** Pb-Free or Green Alternative BGA Parts
A Pb-Free or Green version of this BGA device may be available under a new part number. Typically, the package code for a device is embedded in the part number. Package codes Gxx, YEx (where x can be any letter), YE and WAS will be changed to new codes during the conversion to Pb-Free and Green. The new codes are Zxx, YZx, YZ and WAZ. Flip-chip BGA devices may also have a Cxx version which is 100% RoHS compliant (the Zxx version of a flip-chip BGA device is RoHS compliant with an exemption). To learn more, contact your TI sales rep.
***Mass
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.
Important Part Information
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Product Content Methodology
For an explanation of the methods used to determine material weights, See  Product Content Methodology.
 
Important Information/Disclaimer
TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
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Content details for TI''s packing materials are available at www.ti.com/ecoinfo.
 
Signature:     (click here for a fuller statement with a signed certificate)     
Name/Title:     Robert Furtaw, Vice President, Worldwide SC Quality
For further environmental statements, please go to www.ti.com/ecoinfo
Created on: 10/22/2019
 
RoHS:TI defines"RoHS Compliant" to mean semiconductor products that are compliant with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials unless exempt. Where designed to be soldered at high temperatures, TI "RoHS Compliant" products are suitable for use in specified lead-free processes.
 
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with RoHS pursuant to an exemption.
 
Green: TI defines "Green" to mean free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous plastic materials such as mold compound material). To satisfy customer requests, efforts through early 2Q09 are being made to verify that all non-metal homogeneous material contained in TI Green semiconductor products meet the proposed industry standard threshold levels of <=1000 ppm (0.1%) each of brominated flame retardants (BFRs) and chlorinated flame retardants (CFRs). It includes BeO to be <= 1000ppm (0.1%).