Supplier Name: Texas Instruments Inc. (DUNS# 00-732-1904)
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Form/Declaration Type: Distribute - RoHS and IEC 62474 DB
Created on: 01/24/2020

Results for "OPA4188AIPW"

Summary Results
Search part number TI part number RoHS status REACH status Green status IEC 62474 DB Package | pins Assembly site Lead/ball finish MSL/reflow ratings Mass (mg)***
OPA4188AIPW OPA4188AIPW Y Y Y Y PW ** | 14 Ext-Mfg CU NIPDAU Level-2-260C-1 YEAR 57.200000
OPA4188AIPW OPA4188AIPWR Y Y Y Y PW ** | 14 Ext-Mfg CU NIPDAU Level-2-260C-1 YEAR 57.200000

*Part Number
No material contents are available for this part.
** Pb-Free or Green Alternative BGA Parts
A Pb-Free or Green version of this BGA device may be available under a new part number. Typically, the package code for a device is embedded in the part number. Package codes Gxx, YEx (where x can be any letter), YE and WAS will be changed to new codes during the conversion to Pb-Free and Green. The new codes are Zxx, YZx, YZ and WAZ. Flip-chip BGA devices may also have a Cxx version which is 100% RoHS compliant (the Zxx version of a flip-chip BGA device is RoHS compliant with an exemption). To learn more, contact your TI sales rep.
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.
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Name/Title:     Hubie Payne, Vice President, Worldwide SC Quality
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Created on: 01/24/2020
RoHS:TI defines"RoHS Compliant" to mean semiconductor products that are compliant with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials unless exempt. Where designed to be soldered at high temperatures, TI "RoHS Compliant" products are suitable for use in specified lead-free processes.
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with RoHS pursuant to an exemption.
Green: TI defines "Green" to mean free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous plastic materials such as mold compound material). To satisfy customer requests, efforts through early 2Q09 are being made to verify that all non-metal homogeneous material contained in TI Green semiconductor products meet the proposed industry standard threshold levels of <=1000 ppm (0.1%) each of brominated flame retardants (BFRs) and chlorinated flame retardants (CFRs). It includes BeO to be <= 1000ppm (0.1%).