Concerto™ MCUs: Connectivity without compromise
The new Concerto dual-core MCUs combine TI’s class-leading-performance C28x core and control peripherals with an ARM Cortex-M3 core and connectivity peripherals to deliver a clearly partitioned and optimized architecture that supports real-time control and advanced connectivity in a single, cost-efficient device.

New FRAM non-volatile memory MSP430™ MCUs sampling today. EVMs are now 50% off!
The MSP430FR57xx is the industry’s first ultra-low-power microcontroller with embedded FRAM. Realize never-before-seen power consumption, performance and flexibility with this next-generation embedded memory technology. MSP430FR57xx devices will propel innovation, allowing developers to demand more from their designs and also create new applications.
Order MSP-EXP430FR5739 for 50% off $29 with the coupon code NEWSFLASH-FRAM. Act quickly as discounted quantities are limited. Sample MSP430FR5739 for FREE!

More package options for the MSP430F21x2 now available
The popular MSP430F21x2 series of microcontrollers is now offered in a 32-pin RTV (QFN) package and supports operating temperatures up to 105 degrees. This package provides additional ease to PCB layout by allowing a thinner microcontroller to be integrated into future products. Find out more about this new package and the MSP430F21x2 series.

New TRF7960A RFID Reader/Writer IC brings enhanced functionality
This high performance 13.56MHz Multi-Protocol RFID Reader/Writer IC, with an integrated analog front end (AFE) and built in data-framing system for ISO15693, ISO14443A/B and FeliCa supports data rates up to 848kbits. The TRF7960A with an enhanced ISO14443A decoder and additional register settings allows direct access to all control registers for fine tuning of reader parameters for the highest performance, and makes every application design easy. |
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Concerto™ MCU Brochure
Learn how to get the best of both worlds with the new C2000™ Concerto family of microcontrollers.

White paper: Performance without compromise
With the growing importance of energy efficiency and smart grid technology, there is an increasing need for reliable silicon that supports real-time control with an interface capable of connecting to a wider network. Enter C2000™ Concerto™ microcontrollers.

Concerto™ Frequently Asked Questions
This FAQ covers topics including: product, tools and software, technology and the C2000™ platform.

Implementation of a Single-Phase Electronic Watt-Hour Meter Using MSP430AFE2xx
This application report describes the implementation of a single-phase electronic electricity meter using the Texas Instruments MSP430AFE2xx metering processors. It includes the necessary information with regard to metrology software and hardware procedures for this single chip implementation.

Wireless Remote Controller With Capacitive Touch Pad Using MSP430F51x2
This application report describes the implementation of a two-dimensional capacitive touch pad, using the high-resolution Timer D of the MSP4305132 MCU.

Passive RFID Application Using MSP430F2274
This application report describes a reference design implementing a battery-less RFID application that includes an E-Paper display, using the PaLFI eZ430-TMS37157 RFID board. The sample application code is implemented to run on MSP430F2274 MCU. In addition to handling the communications and E-Paper display driving, the MCU also controls a DC-DC boost converter to supply the higher voltage required by E-Paper.

White paper: Simplifying the transition to digital power for greater efficiency
With its extensive systems expertise, TI understands not only the tradeoffs between analog and digital implementations, but also the challenges this transition poses for analog engineers. To simplify the process of shifting to digital power, TI has created a comprehensive suite of tools to specifically address the most common concerns of analog engineers. |
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| Tool and software updates |
MSP-EXP430FR5739 FRAM Experimenter’s Board Graphical User Interface (GUI)
A GUI has been released that goes with the MSP-EXP430FR5739 FRAM experimenter board. With this GUI, users can see the extreme speed and write endurance benefits of embedded FRAM versus traditional flash-based devices.

New LaunchPad portal page
Checkout the brand new LaunchPad portal page. Here you will find the latest MSP430™ LaunchPad news, projects and links to all of the available BoosterPack plug-in boards. Find everything you need to get started with the MSP430 Value Line microcontrollers at www.ti.com/launchpad.

TMS570 HALCoGen graphical programming software now supports KEIL and IAR tools
The GUI based Hardware Abstraction Layer Code Generation (HALCoGen) software allows developers to quickly and easily get started with TMS570 MCUs by generating initialization code and peripheral communication drivers. Embedded software generated with HALCoGen can now be imported to Code Composer Studio™ IDE, KEIL uVision or IAR Embedded Workbench to be deployed to the TMS570 MCU. See the HALCoGen application notes from KEIL and IAR in addition to the HALCoGen introductory video for more information.

Grace 1.00.01 has released
This latest version of Grace has expanded support to the new MSP430G2xx3 Value Line devices, which feature capacitive touch I/O and hardware UART. In addition, a few bug fixes have been rolled in. For more information, visit www.ti.com/grace.
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Robotics team chooses Stellaris® Jaguar for competition
Members of the FIRST® Robotics Competition Team 2468 from Westlake High School demonstrate their robot for the Logomotion™ game. They explain why they made the switch to the Stellaris® 32-bit ARM® Cortex™-M3 microcontroller’s Jaguar motor control module to help them easily program an agile robot for competition – www.usfirst.org. www.ti.com/make-the-switch

TI Korea to host the 2nd MCU Design Challenge!
TI Korea is hosting the 2nd MCU Design Challenge for university and graduate students. Any individual or team of five students majoring in electronics and electric engineering may apply for the contest. Applicants should submit their applications online by Sept. 23. Applicants can submit ideas related to home electric equipment and appliances as well as industrial solutions based on TI MCUs. |
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Cymbet EnerChip™ CC Inductive Charging Evaluation Kit (CBC-EVAL-11)
The Cymbet CBC-EVAL-11 EnerChip™ CC Inductive Charging Evaluation Kit is a demonstration kit combining an inductive transmitter board with a receiver board containing an EnerChip CC CBC3150 solid state storage device with integrated power management. This kit features an integrated energy storage management and energy harvesting emulation. Learn more.

AMBER wireless offers a new radio-module AMB8520 with TI’ CC430 and integrated ceramic antenna
The AMB8520 is a compact and low-cost radio module for wireless half-duplex communication. The standard version of the CE-certified RF module operates in the 868 MHz frequency band, and it is also available without integrated antenna for the frequency range of 433 and 915 MHz. The AMB8520 can be used with the standard protocol of AMBER as well as TI’s SimpliciTI™ protocol stack. Its compact dimensions and low power consumption features make this radio module an ideal solution for battery-powered devices for data collection, monitoring, remote control and sensor networks.
Faster Delfino™ F2833x development with new PSIM release
The latest PSIM release, v9.1, supports TI floating-point Delfino™ F2833x MCUs through auto code generation and real-time monitoring and debugging functions. With PSIM’s friendly user interface, one can build power and control circuits easily, and generate ready-to-run code for F2833x MCUs with little effort. Communication functions such as SCI and SPI are supported. In addition, the capability to change parameters on-the-fly and display DSP waveforms in real time makes it extremely easy to debug and fine-tune the code.
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| Upcoming events and training |
Concerto™ MCU Training
Take the 11-part online training series to learn all the technical information about the platform, the subsystems, memory configurations, system/clocking/power architecture, software and development environment, and much more.
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