ADC32RF45 Dual-Channel, 14-Bit, 3-GSPS RF-Sampling Analog-to-Digital Converter (ADC) | TI.com

ADC32RF45 (ACTIVE)

Dual-Channel, 14-Bit, 3-GSPS RF-Sampling Analog-to-Digital Converter (ADC)

 

Description

The ADC32RF45 device is a 14-bit, 3.0-GSPS, dual-channel, analog-to-digital converter (ADC) that supports RF sampling with input frequencies up to 4 GHz and beyond. Designed for high signal-to-noise ratio (SNR), the ADC32RF45 delivers a noise spectral density of –155 dBFS/Hz as well as dynamic range and channel isolation over a large input frequency range. The buffered analog input with on-chip termination provides uniform input impedance across a wide frequency range and minimizes sample-and-hold glitch energy.

Each ADC channel can be connected to a dual-band, digital down-converter (DDC) with up to three independent, 16-bit numerically-controlled oscillators (NCOs) per DDC for phase-coherent frequency hopping. Additionally, the ADC is equipped with front-end peak and RMS power detectors and alarm functions to support external automatic gain control (AGC) algorithms.

The ADC32RF45 supports the JESD204B serial interface with subclass 1-based deterministic latency using data rates up to 12.5 Gbps with up to four lanes per ADC. The device is offered in a 72-pin VQFN package (10 mm × 10 mm) and supports the industrial temperature range (–40°C to +85°C).

Features

  • 14-Bit, Dual-Channel, 3.0-GSPS ADC
  • Noise Floor: –155 dBFS/Hz
  • RF Input Supports Up to 4.0 GHz
  • Aperture Jitter: 90 fS
  • Channel Isolation: 95 dB at fIN = 1.8 GHz
  • Spectral Performance (fIN = 900 MHz, –2 dBFS):
    • SNR: 60.9 dBFS
    • SFDR: 67-dBc HD2, HD3
    • SFDR: 77-dBc Worst Spur
  • Spectral Performance (fIN = 1.78 GHz, –2 dBFS):
    • SNR: 58.8 dBFS
    • SFDR: 66-dBc HD2, HD3
    • SFDR: 75-dBc Worst Spur
  • On-Chip Digital Down-Converters:
    • Up to 4 DDCs (Dual-Band Mode)
    • Up to 3 Independent NCOs per DDC
  • On-Chip Input Clamp for Overvoltage Protection
  • Programmable On-Chip Power Detectors with Alarm Pins for AGC Support
  • On-Chip Dither
  • On-Chip Input Termination
  • Input Full-Scale: 1.35 VPP
  • Support for Multi-Chip Synchronization
  • JESD204B Interface:
    • Subclass 1-Based Deterministic Latency
    • 4 Lanes Per Channel at 12.5 Gbps
  • Power Dissipation: 3.2 W/Ch at 3.0 GSPS
  • 72-Pin VQFN Package (10 mm × 10 mm)

Parametrics

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Part number Order Sample rate (Max) (MSPS) Features Resolution (Bits) Number of input channels SNR (dB) ENOB (Bits) SFDR (dB) Power consumption (Typ) (mW) Input range (Vp-p) Interface Operating temperature range (C) Analog input BW (MHz) Input buffer Package Group Package size: mm2:W x L (PKG) Rating Architecture
ADC32RF45 Order now 3000     Ultra High Speed     14     2     60.9     9.7     67     6400     1.35     JESD204B     -40 to 85     3200     Yes     VQFN | 72     72VQFN: 100 mm2: 10 x 10 (VQFN | 72)     Catalog     Pipeline    
ADC32RF42 Order now 1500     Ultra High Speed     14     2     61.1     9.8     67     4000     1.35     JESD204B     -40 to 85     3200     Yes     VQFN | 72     72VQFN: 100 mm2: 10 x 10 (VQFN | 72)     Catalog     Pipeline    
ADC32RF44 Order now 2600     Ultra High Speed     14     2     61.2     9.7     65     5820     1.35     JESD204B     -40 to 85     3200     Yes     VQFN | 72     72VQFN: 100 mm2: 10 x 10 (VQFN | 72)     Catalog     Pipeline