SLOS729D October   2011  – November 2015 AFE5808A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Digital Characteristics
    7. 7.7  Switching Characteristics
    8. 7.8  Timing Requirements
    9. 7.9  Output Interface Timing
    10. 7.10 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low-Noise Amplifier (LNA)
      2. 8.3.2 Voltage-Controlled Attenuator
      3. 8.3.3 Programmable Gain Amplifier
      4. 8.3.4 Analog-to-Digital Converter
      5. 8.3.5 Continuous-Wave (CW) Beamformer
        1. 8.3.5.1 16 × ƒcw Mode
        2. 8.3.5.2 8 × ƒcw and 4 × ƒcw Modes
        3. 8.3.5.3 1 × ƒcw Mode
      6. 8.3.6 Equivalent Circuits
      7. 8.3.7 LVDS Output Interface Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 TGC Mode
      2. 8.4.2 CW Mode
      3. 8.4.3 TGC + CW Mode
      4. 8.4.4 Test Modes
        1. 8.4.4.1 ADC Test Modes
        2. 8.4.4.2 VCA Test Mode
      5. 8.4.5 Power Management
        1. 8.4.5.1 Power and Performance Optimization
        2. 8.4.5.2 Power Management Priority
        3. 8.4.5.3 Partial Power Up and Power Down Mode
        4. 8.4.5.4 Complete Power-Down Mode
        5. 8.4.5.5 Power Saving in CW Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Register Timing
        1. 8.5.1.1 Serial Register Write Description
        2. 8.5.1.2 Register Readout Description
    6. 8.6 Register Maps
      1. 8.6.1 ADC Register Map
      2. 8.6.2 ADC Register/Digital Processing Description
        1. 8.6.2.1  AVERAGING_ENABLE: Address: 2[11]
        2. 8.6.2.2  ADC_OUTPUT_FORMAT: Address: 4[3]
        3. 8.6.2.3  DIGITAL_GAIN_ENABLE: Address: 3[12]
        4. 8.6.2.4  DIGITAL_HPF_ENABLE
        5. 8.6.2.5  DIGITAL_HPF_FILTER_K_CHX
        6. 8.6.2.6  LOW_FREQUENCY_NOISE_SUPPRESSION: Address: 1[11]
        7. 8.6.2.7  LVDS_OUTPUT_RATE_2X: Address: 1[14]
        8. 8.6.2.8  CHANNEL_OFFSET_SUBSTRACTION_ENABLE: Address: 3[8]
        9. 8.6.2.9  SERIALIZED_DATA_RATE: Address: 3[14:13]
        10. 8.6.2.10 TEST_PATTERN_MODES: Address: 2[15:13]
        11. 8.6.2.11 SYNC_PATTERN: Address: 10[8]
      3. 8.6.3 VCA Register Map
      4. 8.6.4 AFE5808A VCA Register Description
        1. 8.6.4.1 LNA Input Impedances Configuration (Active Termination Programmability)
        2. 8.6.4.2 Programmable Gain for CW Summing Amplifier
        3. 8.6.4.3 Programmable Phase Delay for CW Mixer
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 LNA Configuration
          1. 9.2.2.1.1 LNA Input Coupling and Decoupling
          2. 9.2.2.1.2 LNA Noise Contribution
          3. 9.2.2.1.3 Active Termination
          4. 9.2.2.1.4 LNA Gain Switch Response
        2. 9.2.2.2 Voltage-Controlled-Attenuator
        3. 9.2.2.3 CW Operation
          1. 9.2.2.3.1 CW Summing Amplifier
          2. 9.2.2.3.2 CW Clock Selection
          3. 9.2.2.3.3 CW Supporting Circuits
        4. 9.2.2.4 ADC Operation
          1. 9.2.2.4.1 ADC Clock Configurations
          2. 9.2.2.4.2 ADC Reference Circuit
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Driving the Inputs (Analog or Digital) Beyond the Power-Supply Rails
      2. 9.3.2 Driving the Device Signal Input With an Excessively High Level Signal
      3. 9.3.3 Driving the VCNTL Signal With an Excessive Noise Source
      4. 9.3.4 Using a Clock Source With Excessive Jitter, an Excessively Long Input Clock Signal Trace, or Having Other Signals Coupled to the ADC or CW Clock Signal Trace
      5. 9.3.5 LVDS Routing Length Mismatch
      6. 9.3.6 Failure to Provide Adequate Heat Removal
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Related Documentation

For related documentation see the following:

  • THS413x High-Speed, Low-Noise, Fully-Differential I/O Amplifiers, SLOS318.
  • Design for a Wideband Differential Transimpedance DAC Output, SBAA150.
  • Clocking High-Speed Data Converters, SLYT075.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.