SBAS734A March 2017  – July 2017 AMC1306E05 , AMC1306E25 , AMC1306M05 , AMC1306M25


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Ratings
    6. 7.6 Insulation Specifications
    7. 7.7 Safety-Related Certifications
    8. 7.8 Safety Limiting Values
    9. 7.9 Electrical Characteristics: AMC1306x05
    10. 7.10Electrical Characteristics: AMC1306x25
    11. 7.11Switching Characteristics
    12. 7.12Insulation Characteristics Curves
    13. 7.13Typical Characteristics
  8. Detailed Description
    1. 8.1Overview
    2. 8.2Functional Block Diagram
    3. 8.3Feature Description
      1. 8.3.1Analog Input
      2. 8.3.2Modulator
      3. 8.3.3Isolation Channel Signal Transmission
      4. 8.3.4Digital Output
      5. 8.3.5Manchester Coding Feature
    4. 8.4Device Functional Modes
      1. 8.4.1Fail-Safe Output
      2. 8.4.2Output Behavior in Case of a Full-Scale Input
  9. Application and Implementation
    1. 9.1Application Information
      1. 9.1.1Digital Filter Usage
    2. 9.2Typical Applications
      1. 9.2.1Frequency Inverter Application
        1. Requirements
        2. Design Procedure
        3. Curve
      2. 9.2.2Isolated Voltage Sensing
        1. Design Requirements
        2. Design Procedure
        3. Curve
      3. 9.2.3Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1Layout Guidelines
    2. 11.2Layout Example
  12. 12Device and Documentation Support
    1. 12.1Device Support
      1. 12.1.1Device Nomenclature
        1. Glossary
    2. 12.2Documentation Support
      1. 12.2.1Related Documentation
    3. 12.3Related Links
    4. 12.4Receiving Notification of Documentation Updates
    5. 12.5Community Resources
    6. 12.6Trademarks
    7. 12.7Electrostatic Discharge Caution
    8. 12.8Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWV|8
Orderable Information

Device and Documentation Support

Device Support

Device Nomenclature

Isolation Glossary

See the Isolation Glossary

Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now.

Table 2. Related Links

AMC1306E05Click hereClick hereClick hereClick hereClick here
AMC1306E25Click hereClick hereClick hereClick hereClick here
AMC1306M05Click hereClick hereClick hereClick hereClick here
AMC1306M25Click hereClick hereClick hereClick hereClick here

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.


E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.


SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.