SLUSBA1H October   2012  – August 2015

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Device Options
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Charge Profile
      2. 9.3.2  EN1 and EN2 Pins
      3. 9.3.3  External Settings: ISET, ILIM and VIN_DPM
      4. 9.3.4  BC1.2 D+/D- Detection
      5. 9.3.5  Transient Response
      6. 9.3.6  AnyBoot Battery Detection
      7. 9.3.7  Input Voltage Based DPM
      8. 9.3.8  Sleep Mode
      9. 9.3.9  Input Over-Voltage Protection
      10. 9.3.10 NTC Monitor
      11. 9.3.11 Production Test Mode
      12. 9.3.12 Safety Timer
      13. 9.3.13 Watchdog Timer
      14. 9.3.14 Fault Modes
      15. 9.3.15 Dynamic Power Path Management
    4. 9.4 Device Functional Modes
      1. 9.4.1 I2C Operation (Host Mode / Default Mode)
    5. 9.5 Programming
      1. 9.5.1 Serial Interface Description
        1. 9.5.1.1 F/S Mode Protocol
    6. 9.6 Register Maps
      1. 9.6.1 Register #1
      2. 9.6.2 Register #2
      3. 9.6.3 Register #3
      4. 9.6.4 Register #4
      5. 9.6.5 Register #5
      6. 9.6.6 Register #6
      7. 9.6.7 Register #7
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inductor Selection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Summary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

14.1 Package Summary

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