SLUSBZ1B October   2014  – March 2017

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  A29 Coil Specification
      2. 7.3.2  Option Select Pins
      3. 7.3.3  LED Modes
      4. 7.3.4  FOD and Parasitic Metal Object Detect (PMOD) Calibration
      5. 7.3.5  FOD Ping Calibration
      6. 7.3.6  Shut Down Through External Thermal Sensor or Trigger
      7. 7.3.7  Fault Handling and Indication
      8. 7.3.8  Power Transfer Start Signal
      9. 7.3.9  Power-On Reset
      10. 7.3.10 External Reset, RESET Pin
      11. 7.3.11 Trickle Charge and CS100
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Transfer
      2. 7.4.2 Communication
      3. 7.4.3 Power Trains
      4. 7.4.4 Power Train Voltage Control
      5. 7.4.5 Signal Processing Components
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 Current Monitoring Requirements
        3. 8.2.2.3 All Unused Pins
        4. 8.2.2.4 Input Regulators
        5. 8.2.2.5 Input Power Requirements
        6. 8.2.2.6 LED Mode
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature (unless otherwise noted)
MIN MAX UNIT
Voltage applied at V33D to DGND –0.3 3.6 V
Voltage applied at V33A to AGND –0.3 3.6
Voltage applied to any pin(2) –0.3 3.6
Storage temperature range, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±7500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V Supply voltage during operation, V33D, V33A 3.0 3.3 3.6 V
TA Operating free-air temperature range –40 85 °C
TJ Junction temperature 125

6.4 Thermal Information

THERMAL METRIC(1) bq500215 UNIT
RGC (64 pins)
RθJA Junction-to-ambient thermal resistance 29.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.1
RθJB Junction-to-board thermal resistance 8.4
ψJT Junction-to-top characterization parameter 0.2
ψJB Junction-to-board characterization parameter 8.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IV33A Supply current V33A = 3.3 V 8 15 mA
IV33D V33D = 3.3 V 44 55
ITotal V33D = V33A = 3.3 V 52 70
EXTERNALLY SUPPLIED 3.3 V POWER
V33D Digital 3.3-V power TA = 25°C 3 3.6 V
V33A Analog 3.3-V power TA = 25°C 3 3.6
V33Slew 3.3-V slew rate 3.3-V slew rate between 2.3 and 2.9 V,
V33A = V33D		 0.25 V/ms
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_B-
VCM Common mode voltage each pin –0.15 1.631 V
COMM+, COMM– Modulation voltage digital resolution 1 mV
REA Input Impedance Ground reference 0.5 1.5 3 MΩ
IOFFSET Input offset current 1-kΩ source impedance –5 5 µA
ANALOG INPUTS: V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR
VADC_OPEN Voltage indicating open pin LED_MODE, LOSS_THR open 2.37 V
VADC_SHORT Voltage indicating pin shorted to GND LED_MODE, LOSS_THR shorted to ground 0.36
VADC_RANGE Measurement range for voltage monitoring All analog inputs 0 2.5
INL ADC integral nonlinearity –2.5 2.5 mV
Ilkg Input leakage current 3 V applied to pin 100 nA
RIN Input impedance Ground reference 8 MΩ
CIN Input capacitance 10 pF
DIGITAL INPUTS/OUTPUTS
VOL Low-level output voltage IOL = 6 mA , V33D = 3 V DGND1 + 0.25 V
VOH High-level output voltage IOH = –6 mA , V33D = 3 V V33D – 0.6 V
VIH High-level input voltage V33D = 3 V 2.1 3.6
VIL Low-level input voltage V33D = 3.5 V 1.4
IOH(MAX) Output high-source current 4 mA
IOL(MAX) Output low-sink current 4
SYSTEM PERFORMANCE
VRESET Voltage where device comes out of reset V33D pin 2.4 V
tRESET Pulse duration needed for reset RESET pin 2 µs
ƒSW Switching frequency (wireless power transfer) 130 kHz
tdetect Time to detect presence of device requesting power 0.5 s
PWM RAIL
ƒSW_RAIL Switching frequency 520 kHz

6.6 Typical Characteristics

bq500215 PWM_signals.png
CH1 = PWM-A
CH2 = PWM-B
Figure 1. Typical PWM-A and PWM-B Signals
bq500215 Comm_10W.png
CH1 = RX communication signal
CH2 = TX coil voltage
Figure 3. TX Coil and RX Communication Signals
With Rx 10-W Load
bq500215 Comm_NoLoad.png
CH1 = RX communication signal
CH2 = TX coil voltage
Figure 2. TX Coil and RX Communication Signals
With RX No Load