SLUSCD3A August   2015  – October 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 A11 Coil Specification
      2. 7.3.2 Option Select Pins
      3. 7.3.3 LED Modes
      4. 7.3.4 Foreign Object Detection (FOD) and FOD Calibration
      5. 7.3.5 Shut Down Through External Thermal Sensor or Trigger
      6. 7.3.6 Fault Handling and Indication
      7. 7.3.7 Power Transfer Start Signal
      8. 7.3.8 Power-On Reset
      9. 7.3.9 Trickle Charge and CS100
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Transfer
        1. 7.4.1.1 Dynamic Power Limiting™
        2. 7.4.1.2 Operating Frequency Limiting
      2. 7.4.2 Communication
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 Current Monitoring Requirements
        3. 8.2.2.3 Input Voltage Monitoring
        4. 8.2.2.4 Tank Voltage Monitoring
        5. 8.2.2.5 All Unused Pins
        6. 8.2.2.6 Input Regulation
        7. 8.2.2.7 System Input Power Requirements
        8. 8.2.2.8 LED Modes
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Notes
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage Applied at VCC to VSS –0.3 4.1 V
Applied to any pin (excluding VCORE)(2) –0.3 VCC + 0.3 V
Diode current at any device pin –2 2 mA
Maximum junction temperature, TJ 95(3) °C
Storage temperature, Tstg –55 95 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to VSS. VCORE is for internal device use only. No external DC loading or voltage should be applied.
(3) It is recommended to follow the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels. In general, hand soldering is not recommended. However, if hand soldering is required for application prototyping, peak temperature must not exceed 250°C for longer than 30 seconds durations. In addition, during storage, the maximum storage temperature of 95°C should not be exceeded.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage during program execution and FRAM programming (AVCC = DVCC)(1) 2 3.6 V
VSS Supply voltage (AVSS = DVSS) 0 V
TA Operating free-air temperature –40 85 °C
TJ Operating free-air temperature –40 85 °C
C(VCORE) Required capacitor at VCORE(2) 470 nF
C(VCC)/C(VCORE) Capacitor ratio of VCC to VCORE 10 nF
(1) It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be tolerated during power up and operation.
(2) A capacitor tolerance of ±20% or better is required.

6.4 Thermal Information

THERMAL METRIC(1) bq500511 UNIT
RHA (VQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 31.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.5 °C/W
RθJB Junction-to-board thermal resistance 6.8 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 6.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I(AM) Active Mode Supply Current into VCC 3 V 3.45 4.3 mA
L(LPM) Low-Power Mode Supply Current into VCC 3 V –40°C 274 µA
25°C 285 340 µA
60°C 315 µA
85°C 340 455 µA

6.6 Typical Characteristics

bq500511 SW1-2_sluscd3.png
Figure 1. Waveform (bq50002) SW1, SW2
bq500511 DMOUT_sluscd3.png
Figure 2. Waveform COMM1, COMM2