SWRS183A June 2016  – November 2016 CC1350

PRODUCTION DATA. 

  1. 1Device Overview
    1. 1.1Features
    2. 1.2Applications
    3. 1.3Description
    4. 1.4Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
    1. 3.1Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1Pin Diagram - RSM Package
    2. 4.2Signal Descriptions - RSM Package
    3. 4.3Pin Diagram - RHB Package
    4. 4.4Signal Descriptions - RHB Package
    5. 4.5Pin Diagram - RGZ Package
    6. 4.6Signal Descriptions - RGZ Package
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 RF Characteristics
    6. 5.6 Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7 Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8 Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9 Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.101-Mbps GFSK (Bluetooth low energy) - RX
    11. 5.111-Mbps GFSK (Bluetooth low energy) - TX
    12. 5.12PLL Parameters
    13. 5.13ADC Characteristics
    14. 5.14Temperature Sensor
    15. 5.15Battery Monitor
    16. 5.16Continuous Time Comparator
    17. 5.17Low-Power Clocked Comparator
    18. 5.18Programmable Current Source
    19. 5.19DC Characteristics
    20. 5.20Thermal Characteristics
    21. 5.21Timing and Switching Characteristics
      1. 5.21.1Reset Timing
      2. 5.21.2Switching Characteristics: Wakeup and Timing
      3. 5.21.3Clock Specifications
        1. 5.21.3.124-MHz Crystal Oscillator (XOSC_HF)
        2. 5.21.3.232.768-kHz Crystal Oscillator (XOSC_LF)
        3. 5.21.3.348-MHz RC Oscillator (RCOSC_HF)
        4. 5.21.3.432-kHz RC Oscillator (RCOSC_LF)
      4. 5.21.4Flash Memory Characteristics
      5. 5.21.5Synchronous Serial Interface (SSI) Characteristics
    22. 5.22Typical Characteristics
    23. 5.23Typical Characteristics - Sub-1 GHz
    24. 5.24Typical Characteristics - 2.4 GHz
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Main CPU
    3. 6.3 RF Core
    4. 6.4 Sensor Controller
    5. 6.5 Memory
    6. 6.6 Debug
    7. 6.7 Power Management
    8. 6.8 Clock Systems
    9. 6.9 General Peripherals and Modules
    10. 6.10Voltage Supply Domains
    11. 6.11System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1SimplelinkTM CC1350 LaunchPad™ Bluetooth® and Sub-1 GHz Long Range Wireless Development Kit
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Texas Instruments Low-Power RF Website
    5. 8.5 Low-Power RF eNewsletter
    6. 8.6 Additional Information
    7. 8.7 Community Resources
    8. 8.8 Trademarks
    9. 8.9 Electrostatic Discharge Caution
    10. 8.10Export Control Notice
    11. 8.11Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSM|32
  • RGZ|48
  • RHB|32
Orderable Information

Device Overview

Features

  • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller
  • Microcontroller
    • Powerful ARM® Cortex®-M3 Processor
    • EEMBC CoreMark® Score: 142
    • EEMBC ULPBench™ Score: 158
    • Clock Speed up to 48-MHz
    • 128KB of In-System Programmable Flash
    • 8KB of SRAM for Cache
      (or as General-Purpose RAM)
    • 20KB of Ultra-Low-Leakage SRAM
    • 2-Pin cJTAG and JTAG Debugging
    • Supports Over-the-Air (OTA) Update
  • Ultra-Low-Power Sensor Controller
    • Can Run Autonomously From the Rest of the System
    • 16-Bit Architecture
    • 2KB of Ultra-Low-Leakage SRAM for Code and Data
  • Efficient Code-Size Architecture, Placing Parts of
    TI-RTOS, Drivers, Bluetooth® low energy Controller and Bootloader in ROM
  • RoHS-Compliant Package
    • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
    • 5-mm × 5-mm RHB VQFN32 (15 GPIOs)
    • 4-mm × 4-mm RSM VQFN32 (10 GPIOs)
  • Peripherals
    • All Digital Peripheral Pins Can Be Routed to Any GPIO
    • Four General-Purpose Timer Modules
      (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
    • 12-Bit ADC, 200 ksamples/s, 8-Channel Analog MUX
    • Continuous Time Comparator
    • Ultra-Low-Power Clocked Comparator
    • Programmable Current Source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-Time Clock (RTC)
    • AES-128 Security Module
    • True Random Number Generator (TRNG)
    • Support for Eight Capacitive Sensing Buttons
    • Integrated Temperature Sensor
  • SPACER

    SPACER

    SPACER

    SPACER

  • External System
    • On-Chip Internal DC-DC Converter
    • Seamless Integration With the SimpleLink™ CC1190 and CC2592 Range Extenders
  • Low Power
    • Wide Supply Voltage Range: 1.8 to 3.8 V
    • RX: 5.4 mA (Sub-1 GHz), 6.4 mA (Bluetooth low energy, 2.4 GHz)
    • TX at +10 dBm: 13.4 mA (Sub-1 GHz)
    • TX at +9 dBm: 22.3 mA (Bluetooth low energy, 2.4 GHz)
    • TX at +0 dBm: 10.5 mA (Bluetooth low energy, 2.4 GHz)
    • Active-Mode MCU 48 MHz Running Coremark: 2.5 mA (51 µA/MHz)
    • Active-Mode MCU: 48.5 CoreMark/mA
    • Active-Mode Sensor Controller at 24 MHz:
      0.4 mA + 8.2 µA/MHz
    • Sensor Controller, One Wakeup Every Second Performing One 12-Bit ADC Sampling: 0.95 µA
    • Standby: 0.7 µA (RTC Running and RAM and CPU Retention)
    • Shutdown: 185 nA (Wakeup on External Events)
  • RF Section
    • 2.4-GHz RF Transceiver Compatible With Bluetooth low energy 4.2 Specification
    • Excellent Receiver Sensitivity –124 dBm Using Long-Range Mode, –110 dBm at 50 kbps
      (Sub-1 GHz),
      –87 dBm at Bluetooth low energy
    • Excellent Selectivity (±100 kHz): 56 dB
    • Excellent Blocking Performance (±10 MHz):
      90 dB
    • Programmable Output Power up to +15 dBm (Sub-1 GHz) and +9 dBm at 2.4 GHz (Bluetooth low energy)
    • Single-Ended or Differential RF Interface
    • Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
      • ETSI EN 300 220, EN 303 204 (Europe)
      • EN 300 440 Class 2 (Europe)
      • EN 300 328 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
      • ARIB STD-T108 (Japan)
    • Wireless M-Bus and Selected IEEE® 802.15.4g PHY
  • Tools and Development Environment
    • Full-Feature and Low-Cost Development Kits
    • Multiple Reference Designs for Different RF Configurations
    • Packet Sniffer PC Software
    • Sensor Controller Studio
    • SmartRF™ Studio
    • SmartRF Flash Programmer 2
    • IAR Embedded Workbench® for ARM
    • Code Composer Studio™

Applications

  • 315-, 433-, 470-, 500-, 779-, 868-, 915-,
    920-MHz and 2.4-GHz ISM and SRD Systems
  • Low-Power Wireless Systems
    With 50-kHz to 5-MHz Channel Spacing
  • Home and Building Automation
  • Wireless Alarm and Security Systems
  • Industrial Monitoring and Control
  • Bluetooth low energy Beacon Management
  • Bluetooth low energy Commissioning
  • Smart Grid and Automatic Meter Reading
  • Wireless Healthcare Applications
  • Wireless Sensor Networks
  • Active RFID
  • IEEE 802.15.4g, IP-Enabled Smart Objects (6LoWPAN), Wireless M-Bus, KNX Systems,
    Wi-SUN™, and Proprietary Systems
  • Energy-Harvesting Applications
  • Electronic Shelf Label (ESL)
  • Long-Range Sensor Applications
  • Heat-Cost Allocators

Description

The CC1350 is a member of the CC26xx and CC13xx family of cost-effective, ultra-low-power, 2.4-GHz and Sub-1 GHz RF devices from Texas Instruments™. Very low active RF and microcontroller (MCU) current consumption, in addition to flexible low-power modes, provide excellent battery lifetime and allow long-range operation on small coin-cell batteries and in energy-harvesting applications.

The CC1350 is the first device in the CC13xx and CC26xx family of cost-effective, ultra-low-power wireless MCUs capable of handling both Sub-1 GHz and 2.4-GHz RF frequencies. The CC1350 device combines a flexible, very low-power RF transceiver with a powerful 48-MHz ARM® Cortex®-M3 microcontroller in a platform supporting multiple physical layers and RF standards. A dedicated Radio Controller (Cortex®-M0) handles low-level RF protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power and flexibility to handle both Sub-1 GHz protocols and 2.4 GHz protocols (for example Bluetooth® low energy). This enables the combination of a Sub-1 GHz communication solution that offers the best possible RF range together with a Bluetooth low energy smartphone connection that enables great user experience through a phone application. The Sub-1 GHz only device in this family is the CC1310.

The CC1350 device is a highly integrated, true single-chip solution incorporating a complete RF system and an on-chip DC-DC converter.

Sensors can be handled in a very low-power manner by a dedicated autonomous ultra-low-power MCU that can be configured to handle analog and digital sensors; thus the main MCU (Cortex-M3) can maximize sleep time.

The CC1350 power and clock management and radio systems require specific configuration and handling by software to operate correctly, which has been implemented in the TI-RTOS. TI recommends using this software framework for all application development on the device. The complete TI-RTOS and device drivers are offered in source code free of charge.

Device Information(1)

PART NUMBERPACKAGEBODY SIZE (NOM)
CC1350F128RGZVQFN (48)7.00 mm × 7.00 mm
CC1350F128RHBVQFN (32)5.00 mm × 5.00 mm
CC1350F128RSMVQFN (32)4.00 mm × 4.00 mm
For more information, see Section 9.

Functional Block Diagram

Figure 1-1 shows a block diagram for the CC1350 device.

CC1350 CC1350_Block_Diagram_SWRS183.gif Figure 1-1 CC1350 Block Diagram