SWRS201A January 2017  – August 2017 CC2640R2F-Q1

PRODUCTION DATA. 

  1. 1Device Overview
    1. 1.1Features
    2. 1.2Applications
    3. 1.3Description
    4. 1.4Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
    1. 3.1Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1Pin Diagram - RGZ Package
    2. 4.2Signal Descriptions - RGZ Package
    3. 4.3Wettable Flanks
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 General Characteristics
    6. 5.6 1-Mbps GFSK (Bluetooth low energy Technology) - RX
    7. 5.7 1-Mbps GFSK (Bluetooth low energy Technology) - TX
    8. 5.8 24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9 32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.1048-MHz RC Oscillator (RCOSC_HF)
    11. 5.1132-kHz RC Oscillator (RCOSC_LF)
    12. 5.12ADC Characteristics
    13. 5.13Temperature Sensor
    14. 5.14Battery Monitor
    15. 5.15Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17Programmable Current Source
    18. 5.18Synchronous Serial Interface (SSI)
    19. 5.19DC Characteristics
    20. 5.20Thermal Resistance Characteristics for RGZ Package
    21. 5.21Timing Requirements
    22. 5.22Switching Characteristics
    23. 5.23Typical Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Main CPU
    4. 6.4 RF Core
    5. 6.5 Sensor Controller
    6. 6.6 Memory
    7. 6.7 Debug
    8. 6.8 Power Management
    9. 6.9 Clock Systems
    10. 6.10General Peripherals and Modules
    11. 6.11System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1Application Information
    2. 7.27 × 7 Internal Differential (7ID) Application Circuit
      1. 7.2.1Layout
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Texas Instruments Low-Power RF Website
    5. 8.5 Community Resources
    6. 8.6 Additional Information
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Export Control Notice
    10. 8.10Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1Packaging Information

Device Overview

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 2: –40°C to +105°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful ARM® Cortex®-M3
    • EEMBC CoreMark® Score: 142
    • Up to 48-MHz Clock Speed
    • 275-KB Nonvolatile Memory, Including 128-KB In-System Programmable Flash
    • Up to 28-KB System SRAM, of Which 20 KB is Ultra-Low-Leakage SRAM
    • 8-KB SRAM for Cache or System RAM Use
    • 2-Pin cJTAG and JTAG Debugging
    • Supports Over-the-Air Upgrade (OTA)
  • Ultra-Low Power Sensor Controller
    • Can Run Autonomously From the Rest of the System
    • 16-Bit Architecture
    • 2-KB Ultra-Low Leakage SRAM for Code and Data
  • Efficient Code Size Architecture, Placing Drivers, Bluetooth® low energy Controller, and Bootloader in ROM to Make More Flash Available for the Application
  • RoHS-Compliant Automotive Grade Package
    • 7-mm × 7-mm RGZ VQFN48 With Wettable Flanks
  • Peripherals
    • 31 GPIOs, All Digital Peripheral Pins Can Be Routed to Any GPIO
    • Four General-Purpose Timer Modules
      (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
    • 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX
    • Continuous Time Comparator
    • Ultra-Low Power Analog Comparator
    • Programmable Current Source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-Time Clock (RTC)
    • AES-128 Security Module
    • True Random Number Generator (TRNG)
    • Support for Eight Capacitive-Sensing Buttons
    • Integrated Temperature Sensor
  • External System
    • On-Chip Internal DC/DC Converter
    • Very Few External Components
    • Seamless Integration With the SimpleLink™ CC2590 and CC2592 Range Extenders
  • Low Power
    • Wide Supply Voltage Range: 1.8 to 3.8 V
    • Active-Mode RX: 6.1 mA
    • Active-Mode TX at 0 dBm: 7.0 mA
    • Active-Mode TX at +5 dBm: 9.3 mA
    • Active-Mode MCU: 61 µA/MHz
    • Active-Mode MCU: 48.5 CoreMark/mA
    • Active-Mode Sensor Controller:
      0.4 mA + 8.2 µA/MHz
    • Standby: 1.3 µA (RTC Running and RAM/CPU Retention)
    • Shutdown: 150 nA (Wake Up on External Events)
  • RF Section
    • 2.4-GHz RF Transceiver Compatible With Bluetooth low energy (BLE) 4.2 and 5 Specifications
    • Excellent Receiver Sensitivity (–97 dBm for Bluetooth low energy 1 Mbps), Selectivity, and Blocking Performance
    • Programmable Output Power up to +5 dBm
    • Link budget of 102 dB for Bluetooth low energy 1 Mbps
    • Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
      • ETSI EN 300 328 and EN 300 440 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Tools and Development Environment
    • Full-Feature Development Kits
    • Sensor Controller Studio
    • SmartRF™ Tools Portfolio
    • IAR Embedded Workbench® for ARM
    • Code Composer Studio™ (CCS)
    • CCS Cloud

Applications

  • Automotive Applications
    • Car Access
    • Keyless Entry
    • Passive Entry/Passive Start (PEPS) Systems
    • Car Sharing
    • Piloted Parking
    • Wireless Onboard Diagnostics (OBD)
    • Cable Replacement
    • Remote Control
    • Sensors
  • Industrial
    • Logistics
    • Production and Manufacturing Automation
    • Asset Tracking and Management
    • HMI and Remote Display
    • Access Control

Description

The SimpleLink™ Bluetooth® low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 4.2 and Bluetooth 5 low energy automotive applications such as Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity.

The device is a member of the SimpleLink ultra-low power family of cost-effective, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime allowing for operation on small coin-cell batteries and a low power-consumption footprint for nodes connected to the car battery. Excellent receiver sensitivity and programmable output power provides industry leading RF performance that is required for the demanding automotive RF environment.

The CC2640R2F-Q1 wireless MCU contains a 32-bit ARM® Cortex®-M3 processor that runs at 48 MHz as the main application processor and includes the Bluetooth 4.2 low energy controller and host libraries embedded in ROM. This architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application.

Additionally, the device is AEC-Q100 Qualified at the Grade 2 temperature range (–40°C to +105°C) and is offered in a 7-mm × 7-mm VQFN package with wettable flanks. The wettable flanks help reduce production-line cost and increase the reliability enabled by optical inspection of solder points.

The Bluetooth low energy Software Stack is available free of charge from ti.com.

Device Information(1)

PART NUMBERPACKAGEBODY SIZE (NOM)
CC2640R2FTWRGZQ1VQFN (48) with Wettable Flanks7.00 mm × 7.00 mm
For more information, see Section 9.

Functional Block Diagram

Figure 1-1 shows a block diagram for the CC2640R2F-Q1 device.

CC2640R2F-Q1 CC2640R2F_Q1_FBD.gif Figure 1-1 Block Diagram