SWAS032F July 2013  – February 2015 CC3200

PRODUCTION DATA. 

  1. 1Device Overview
    1. 1.1Features
    2. 1.2Applications
    3. 1.3Description
    4. 1.4Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1Pin Attributes and Pin Multiplexing
      1. 3.1.1Connections for Unused Pins
      2. 3.1.2Recommended Pin Multiplexing Configurations
    2. 3.2Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    3. 3.3Pad State After Application of Power To Chip But Prior To Reset Release
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Handling Ratings
    3. 4.3 Power-On Hours
    4. 4.4 Recommended Operating Conditions
    5. 4.5 Brown-Out and Black-Out
    6. 4.6 Electrical Characteristics (3.3 V, 25°C)
    7. 4.7 WLAN Receiver Characteristics
    8. 4.8 WLAN Transmitter Characteristics
    9. 4.9 Current Consumption
    10. 4.10Thermal Characteristics for RGC Package
    11. 4.11Timing and Switching Characteristics
      1. 4.11.1Power Supply Sequencing
      2. 4.11.2Reset Timing
        1. 4.11.2.1nRESET (32K XTAL)
        2. 4.11.2.2nRESET (External 32K)
        3. 4.11.2.3Wakeup from Hibernate
      3. 4.11.3Clock Specifications
        1. 4.11.3.1Slow Clock Using Internal Oscillator
        2. 4.11.3.2Slow Clock Using an External Clock
        3. 4.11.3.3Fast Clock (Fref) Using an External Crystal
        4. 4.11.3.4Fast Clock (Fref) Using an External Oscillator
        5. 4.11.3.5Input Clocks/Oscillators
        6. 4.11.3.6WLAN Filter Requirements
      4. 4.11.4Peripherals
        1. 4.11.4.1SPI
          1. 4.11.4.1.1SPI Master
          2. 4.11.4.1.2SPI Slave
        2. 4.11.4.2McASP
          1. 4.11.4.2.1I2S Transmit Mode
          2. 4.11.4.2.2I2S Receive Mode
        3. 4.11.4.3GPIO
          1. 4.11.4.3.1GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
          2. 4.11.4.3.2GPIO Output Transition Time Parameters (Vsupply = 1.8 V)
          3. 4.11.4.3.3GPIO Input Transition Time Parameters
        4. 4.11.4.4I2C
        5. 4.11.4.5IEEE 1149.1 JTAG
        6. 4.11.4.6ADC
        7. 4.11.4.7Camera Parallel Port
        8. 4.11.4.8UART
  5. 5Detailed Description
    1. 5.1Overview
      1. 5.1.1Device Features
    2. 5.2Functional Block Diagram
    3. 5.3ARM Cortex-M4 Processor Core Subsystem
    4. 5.4CC3200 Device Encryption
    5. 5.5Wi-Fi Network Processor Subsystem
    6. 5.6Power-Management Subsystem
      1. 5.6.1VBAT Wide-Voltage Connection
      2. 5.6.2Preregulated 1.85 V
    7. 5.7Low-Power Operating Mode
    8. 5.8Memory
      1. 5.8.1External Memory Requirements
      2. 5.8.2Internal Memory
        1. 5.8.2.1SRAM
        2. 5.8.2.2ROM
        3. 5.8.2.3Memory Map
    9. 5.9Boot Modes
      1. 5.9.1Overview
      2. 5.9.2Invocation Sequence/Boot Mode Selection
      3. 5.9.3Boot Mode List
  6. 6Applications and Implementation
    1. 6.1Application Information
      1. 6.1.1Typical Application - CC3200 Wide-Voltage Mode
      2. 6.1.2Typical Application - CC3200 Preregulated 1.85-V Mode
  7. 7Device and Documentation Support
    1. 7.1Device Support
      1. 7.1.1Development Support
        1. 7.1.1.1PinMux Tool
        2. 7.1.1.2Radio Tool
        3. 7.1.1.3Uniflash Flash Programmer
      2. 7.1.2Device Nomenclature
    2. 7.2Documentation Support
    3. 7.3Community Resources
    4. 7.4Trademarks
    5. 7.5Electrostatic Discharge Caution
    6. 7.6Glossary
  8. 8Mechanical Packaging and Orderable Information

6 Applications and Implementation

6.1 Application Information

6.1.1 Typical Application – CC3200 Wide-Voltage Mode

Figure 6-1 shows the schematics for an application using the CC3200 wide-voltage mode.

cc3200_wide_voltage_ds_sc_v0p3.gif
NOTE: This schematic is rated from 2.3 to 3.6 V because of the limitation of the serial flash.
Figure 6-1 Schematics for CC3200 Wide-Voltage Mode Application

Table 6-1 lists the bill of materials for an application using the CC3200 wide-voltage mode.

Table 6-1 Bill of Materials for CC3200 Wide-Voltage Mode Application

ItemQtyPart ReferenceValueManufacturerPart NumberDescription
13C1 C2 C34.7 µFSamsung Electro-Mechanics America, IncCL05A475MQ5NRNCCapacitor, Ceramic: 4.7 µF 6.3 V 20% X5R 0402
213C4 C5 C8 C11 C12 C13 C14 C17 C19 C20 C21 C22 C230.1 µFTaiyo YudenLMK105BJ104KV-FCapacitor, Ceramic: 0.1 µF 10 V 10% X5R 0402
31C91.0 pFMurata Electronics North AmericaGJM1555C1H1R0BB01DCapacitor, Ceramic: 1 pF 50 V NP0 0402
42C10 C1810 µFMurata Electronics North AmericaGRM188R60J106ME47DCapacitor, Ceramic: 10 µF 6.3 V 20% X5R 0603
52C15 C1622 µFTaiyo YudenAMK107BBJ226MAHTCapacitor, Ceramic: 22 µF 4 V 20% X5R 0603
62C24 C4610 pFMurata Electronics North AmericaGRM1555C1H100FA01DCapacitor, Ceramic: 10 pF 50 V 1% NP0 0402
72C42 C496.2 pFMurata Electronics North AmericaGRM1555C1H6R2BA01DCapacitor, Ceramic: 6.2 pF 50 V NP0 0402
81E22.4-GHz AntTaiyo YudenAH316M245001-TChip Antenna: 50 Ω Bluetooth WLAN ZigBee® WIMAX
91FL12.4-GHz FilterTDK-EpcosDEA202450BT-1294C1-HFilter, Bandpass: 2.4 GHz WLAN SMD
101L13.6 nHMurata Electronics North AmericaLQP15MN3N6B02DInductor: 3.6 nH 0.1 nH 0402
112L2 L82.2 µHMurata Electronics North AmericaLQM2HPN2R2MG0LInductor: 2.2 µH 20% 1300 mA 1008
121L31 µHMurataLQM2HPN1R0MJ0LInductor, Power: 1.0 µH 1500 mA 1007
161U18M
(1M x 8)
Micron Technology IncM25PX80-VMN6TPIC Flash: 8Mb 75 MHz 8SO
171U2CC3200Texas InstrumentsCC3200R1ARM M4 MCU with 802.11bgn WI-FI
181Y1CrystalAbracon CorporationABS07-32.768KHZ-TCrystal: 32.768 kHz 12.5 pF SMD
191Y2CrystalEpsonQ24FA20H00396Crystal: 40 MHz 8 pF SMD

NOTE

Use any 5% tolerance resistor 0402 or higher package.

6.1.2 Typical Application – CC3200 Preregulated 1.85-V Mode

Figure 6-2 shows the schematics for an application using the CC3200 preregulated 1.85-V mode.

cc3200_1p85v_mode_ds_sch_v0p3.gifFigure 6-2 Schematics for CC3200 Preregulated 1.85-V Mode Application

Table 6-1 lists the bill of materials for an application using the CC3200 preregulated 1.85-V mode.

Table 6-2 Bill of Materials for CC3200 Preregulated 1.85-V Mode Application

ItemQtyPart ReferenceValueManufacturerPart NumberDescription
13C1 C2 C34.7 µFSamsung Electro-Mechanics America, IncCL05A475MQ5NRNCCapacitor, Ceramic: 4.7 µF 6.3 V 20% X5R 0402
212C4 C5 C8 C11 C12 C14 C17 C19 C20 C21 C22 C230.1 µFTaiyo YudenLMK105BJ104KV-FCapacitor, Ceramic: 0.1 µF 10 V 10% X5R 0402
31C91.0 pFMurata Electronics North AmericaGJM1555C1H1R0BB01DCapacitor, Ceramic: 1 pF 50 V NP0 0402
41C1622 µFTaiyo YudenAMK107BBJ226MAHTCapacitor, Ceramic: µF 4 V 20% X5R 0603
52C13 C1810 µFMurata Electronics North AmericaGRM188R60J106ME47DCapacitor, Ceramic: 10 µF 6.3 V 20% X5R 0603
62C24 C4610 pFMurata Electronics North AmericaGRM1555C1H100FA01DCapacitor, Ceramic: 10 pF 50 V 1% NP0 0402
72C42 C496.2 pFMurata Electronics North AmericaGRM1555C1H6R2BA01DCapacitor, Ceramic: 6.2 pF 50 V NP0 0402
81E22.4-GHz AntTaiyo YudenAH316M245001-TAntenna, Chip: 50 Ω Bluetooth WLAN ZigBee WIMAX
91FL12.4-GHz FilterTDK-EpcosDEA202450BT-1294C1-HFilter, Bandpass: 2.4 GHz WLAN SMD
101L13.6 nHMurata Electronics North AmericaLQP15MN3N6B02DInductor: 3.6 nH 0.1 nH 0402
111L82.2 µHMurata Electronics North AmericaLQM2HPN2R2MG0LInductor: 2.2 µH 20% 1300 mA 1008
151U18M
(1M x 8)
WinbondW25Q80BWZPIGIC FLASH 8Mb 75 MHz 8WSON
161U2CC3200Texas InstrumentsCC3200R1ARM M4 MCU with 802.11bgn WIFI
171Y1CrystalAbracon CorporationABS07-32.768KHZ-TCrystal: 32.768 kHz 12.5 pF SMD
181Y2CrystalEpsonQ24FA20H00396Crystal: 40 MHz 8 pF SMD

NOTE

Use any 5% tolerance resistor 0402 or higher package.