SLPS667A February   2017  – July 2017 CSD17318Q2

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Characteristics
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical Data
    1. 7.1 Q2 Package Dimensions
      1. 7.1.1 Recommended PCB Pattern
      2. 7.1.2 Recommended Stencil Pattern
    2. 7.2 Q2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical Data

7.1 Q2 Package Dimensions

CSD17318Q2 Mech.png
  1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
  2. This drawing is subject to change without notice.
  3. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.

7.1.1 Recommended PCB Pattern

CSD17318Q2 PCB1.png
CSD17318Q2 PCB2.png
  1. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB Attachment (SLUA271).

7.1.2 Recommended Stencil Pattern

CSD17318Q2 Stencil.png
  1. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

7.2 Q2 Tape and Reel Information

CSD17318Q2 M0168-01_LPS235.gif

NOTES:

1. Measured from centerline of sprocket hole to centerline of pocket.
2. Cumulative tolerance of 10 sprocket holes is ±0.20.
3. Other material available.
4. Typical SR of form tape Max 109 OHM/SQ.
5. All dimensions are in mm, unless otherwise specified.