SLPS689 May   2017 CSD22206W

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 CSD22206W Package Dimensions
    2. 7.2 Recommended Land Pattern

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YZF|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

CSD22206W Package Dimensions

CSD22206W M0171-01_LPS213.gif

NOTE:

All dimensions are in mm (unless otherwise specified).

Table 1. Pinout

POSITION DESIGNATION
A1 Gate
A2, A3, B1, B2, B3 Source
C1, C2, C3 Drain

Recommended Land Pattern

CSD22206W M0172-01_LPS213.gif

NOTE:

All dimensions are in mm (unless otherwise specified).