SLPS597C
April 2017 – April 2018
CSD88599Q5DC
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Specifications
5.1
Absolute Maximum Ratings (1)
5.2
Recommended Operating Conditions
5.3
Power Block Performance
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Power Block Device Characteristics
5.7
Typical Power Block MOSFET Characteristics
6
Application and Implementation
6.1
Application Information
6.2
Brushless DC Motor With Trapezoidal Control
6.3
Power Loss Curves
6.4
Safe Operating Area (SOA) Curve
6.5
Normalized Power Loss Curves
6.6
Design Example – Regulate Current to Maintain Safe Operation
6.7
Design Example – Regulate Board and Case Temperature to Maintain Safe Operation
7
Layout
7.1
Layout Guidelines
7.1.1
Electrical Performance
7.1.2
Thermal Considerations
7.2
Layout Example
8
Device and Documentation Support
8.1
Receiving Notification of Documentation Updates
8.2
Support Resources
8.3
Trademarks
8.4
Electrostatic Discharge Caution
8.5
Glossary
9
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DMM|22
MPSS081A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slps597c_oa
slps597c_pm
9.2
Land Pattern Recommendation
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
This package is designed to be soldered to a thermal pad on the board. For more information, see
QFN/SON PCB Attachment
(SLUA271).
Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.