Home Power management MOSFETs Power stages

CSD95375Q4M

ACTIVE

25A Synchronous Buck NexFET™ Power Stage

Product details

VDS (V) 20 Power loss (W) 2.2 Ploss current (A) 15 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 25 Operating temperature range (°C) -40 to 150 Features Diode emulation mode with FCCM, Ultra-low inductance package Rating Catalog
VDS (V) 20 Power loss (W) 2.2 Ploss current (A) 15 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 25 Operating temperature range (°C) -40 to 150 Features Diode emulation mode with FCCM, Ultra-low inductance package Rating Catalog
VSON-CLIP (DPC) 8 15.75 mm² 4.5 x 3.5
  • 93% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A,
    Peak 60 A
  • High Frequency Operation (up to 2 MHz)
  • High Density - SON 3.5 × 4.5-mm
    Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead-Free Terminal
    Plating
  • Halogen Free
  • 93% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A,
    Peak 60 A
  • High Frequency Operation (up to 2 MHz)
  • High Density - SON 3.5 × 4.5-mm
    Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead-Free Terminal
    Plating
  • Halogen Free

The CSD95375Q4M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95375Q4M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
CSD95377Q4M ACTIVE 20 V 35 A SON 3.5 x 4.5 mm synchronous buck NexFET™ power stage Slightly higher efficiency

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet CSD95375Q4M Synchronous Buck NexFET Power Stage datasheet (Rev. A) PDF | HTML 04 Sep 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

CSD95375Q4M PSpice Model

SLPM117.ZIP (17 KB) - PSpice Model
Package Pins Download
VSON-CLIP (DPC) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos