CSD97376Q4M 30 V 20 A SON 3.5 x 4.5 mm synchronous buck NexFET™ power stage | TI.com

CSD97376Q4M (NRND) 30 V 20 A SON 3.5 x 4.5 mm synchronous buck NexFET™ power stage

 

Not Recommended for New Designs (NRND)

Replaced By CSD97394Q4M – The device is an EXACT EQUIVALENT in functionality and parametrics to the compared device.

TI does not recommend using this part in a new design. This product continues to be in production to support existing customers.

Description

The CSD97376Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

Features

  • 90% System Efficiency at 15 A
  • Max Rated Continuous Current 20 A, Peak 45 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm × 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free