SBAS538D December   2013  – December 2021 DAC7750 , DAC8750

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics: AC
    7. 7.7  Timing Requirements: Write Mode
    8. 7.8  Timing Requirements: Readback Mode
    9. 7.9  Timing Diagrams
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  DAC Architecture
      2. 8.3.2  Current Output Stage
      3. 8.3.3  Internal Reference
      4. 8.3.4  Digital Power Supply
      5. 8.3.5  DAC Clear
      6. 8.3.6  Power-On Reset
      7. 8.3.7  Alarm Detection
      8. 8.3.8  Watchdog Timer
      9. 8.3.9  Frame Error Checking
      10. 8.3.10 User Calibration
      11. 8.3.11 Programmable Slew Rate
    4. 8.4 Device Functional Modes
      1. 8.4.1 Setting Current-Output Ranges
      2. 8.4.2 Current-Setting Resistor
      3. 8.4.3 BOOST Configuration for IOUT
      4. 8.4.4 Filtering The Current Output
      5. 8.4.5 Output Current Monitoring
      6. 8.4.6 HART Interface
        1. 8.4.6.1 Implementing HART in 4-mA to 20-mA Mode
        2. 8.4.6.2 Implementing HART in All Current Output Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 SPI Shift Register
        2. 8.5.1.2 Write Operation
        3. 8.5.1.3 Read Operation
        4. 8.5.1.4 Stand-Alone Operation
        5. 8.5.1.5 Multiple Devices on the Bus
    6. 8.6 Register Maps
      1. 8.6.1 DACx750 Register Descriptions
        1. 8.6.1.1 Control Register
        2. 8.6.1.2 Configuration Register
        3. 8.6.1.3 DAC Registers
        4. 8.6.1.4 Reset Register
        5. 8.6.1.5 Status Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 HART Implementation
        1. 9.1.1.1 Using the CAP2 Pin
        2. 9.1.1.2 Using the ISET-R Pin
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Current output options:
    • 0 mA to 24 mA
    • 4 mA to 20 mA
    • 0 mA to 20 mA
  • ±0.1% FSR typical total unadjusted error (TUE)
  • DNL: ±1 LSB maximum
  • Maximum loop compliance voltage: AVDD – 2 V
  • Internal 5-V reference: 10 ppm/°C (maximum)
  • Internal 4.6-V power-supply output
  • CRC frame error check
  • Watchdog timer
  • Thermal alarm
  • Open-circuit alarm
  • Pins to monitor output current
  • On-chip fault alarm
  • User-calibration for offset and gain
  • Wide temperature range: –40°C to +125°C
  • Packages: 6-mm × 6-mm 40-pin VQFN and 24-pin HTSSOP