SLVSBY7 February   2017 DAC8775

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Write and Readback Mode
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Current Output Stage
      2. 8.3.2  Voltage Output Stage
      3. 8.3.3  Buck-Boost Converter
        1. 8.3.3.1 Buck-Boost Converters Outputs
        2. 8.3.3.2 Selecting and Enabling Buck-Boost Converters
        3. 8.3.3.3 Configurable Clamp Feature and Current Output Settling Time
          1. 8.3.3.3.1 Default Mode - CCLP[1:0] = "00" - Current Output Only
          2. 8.3.3.3.2 Fixed Clamp Mode - CCLP[1:0] = "01" - Current and Voltage Output
          3. 8.3.3.3.3 Auto Learn Mode - CCLP[1:0] = "10" - Current Output Only
          4. 8.3.3.3.4 High Side Clamp (HSCLMP)
        4. 8.3.3.4 Buck-Boost Converters and Open Circuit Current Output
      4. 8.3.4  Analog Power Supply
      5. 8.3.5  Digital Power Supply
      6. 8.3.6  Internal Reference
      7. 8.3.7  Power-On-Reset
      8. 8.3.8  ALARM Pin
      9. 8.3.9  Power GOOD Bits
      10. 8.3.10 Status Register
      11. 8.3.11 Status Mask
      12. 8.3.12 Alarm Action
      13. 8.3.13 Watchdog Timer
      14. 8.3.14 Programmable Slew Rate
      15. 8.3.15 HART Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Peripheral Interface (SPI)
        1. 8.4.1.1 Stand-Alone Operation
        2. 8.4.1.2 Daisy-Chain Operation
      2. 8.4.2 SPI Shift Register
      3. 8.4.3 Write Operation
      4. 8.4.4 Read Operation
      5. 8.4.5 Updating the DAC Outputs and LDAC Pin
        1. 8.4.5.1 Asynchronous Mode
        2. 8.4.5.2 Synchronous Mode
      6. 8.4.6 Hardware RESET Pin
      7. 8.4.7 Hardware CLR Pin
      8. 8.4.8 Frame Error Checking
      9. 8.4.9 DAC Data Calibration
        1. 8.4.9.1 DAC Data Gain and Offset Calibration Registers
    5. 8.5 Register Maps
      1. 8.5.1 DAC8775 Commands
      2. 8.5.2 Register Maps and Bit Functions
        1. 8.5.2.1  No Operation Register (address = 0x00) [reset = 0x0000]
        2. 8.5.2.2  Reset Register (address = 0x01) [reset = 0x0000]
        3. 8.5.2.3  Reset Config Register (address = 0x02) [reset = 0x0000]
        4. 8.5.2.4  Select DAC Register (address = 0x03) [reset = 0x0000]
        5. 8.5.2.5  Configuration DAC Register (address = 0x04) [reset = 0x0000]
        6. 8.5.2.6  DAC Data Register (address = 0x05) [reset = 0x0000]
        7. 8.5.2.7  Select Buck-Boost Converter Register (address = 0x06) [reset = 0x0000]
        8. 8.5.2.8  Configuration Buck-Boost Register (address = 0x07) [reset = 0x0000]
        9. 8.5.2.9  DAC Channel Calibration Enable Register (address = 0x08) [reset = 0x0000]
        10. 8.5.2.10 DAC Channel Gain Calibration Register (address = 0x09) [reset = 0x0000]
        11. 8.5.2.11 DAC Channel Offset Calibration Register (address = 0x0A) [reset = 0x0000]
        12. 8.5.2.12 Status Register (address = 0x0B) [reset = 0x1000]
        13. 8.5.2.13 Status Mask Register (address = 0x0C) [reset = 0x0000]
        14. 8.5.2.14 Alarm Action Register (address = 0x0D) [reset = 0x0000]
        15. 8.5.2.15 User Alarm Code Register (address = 0x0E) [reset = 0x0000]
        16. 8.5.2.16 Reserved Register (address = 0x0F) [reset = N/A]
        17. 8.5.2.17 Write Watchdog Timer Register (address = 0x10) [reset = 0x0000]
        18. 8.5.2.18 Device ID Register (address = 0x11) [reset = 0x0000]
        19. 8.5.2.19 Reserved Register (address 0x12 - 0xFF) [reset = N/A]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Buck-Boost Converter External Component Selection
      2. 9.1.2 Voltage and Current Ouputs on a Shared Terminal
      3. 9.1.3 Optimizing Current Output Settling time with Auto learn Mode
      4. 9.1.4 Protection for Industrial Transients
      5. 9.1.5 Implementing HART with DAC8775
    2. 9.2 Typical Application
      1. 9.2.1 1W Power Dissipation, Quad Channel, EMC and EMI Protected Analog Output Module with Adaptive Power Management
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

  • DAC8775 EVM User's Guide (SBAU248)
  • LM5166 3-V to 65-V Input, 500-mA Synchronous Buck Converter with Ultra-Low IQ Data Sheet (SNVSA67)
  • ISO76x1 Low-Power Triple and Quad-Channels Digital Isolators (SLLSEC3)

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

Microwire, E2E are trademarks of Texas Instruments.

SPI, QSPI are trademarks of Motorola, Inc.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.