DLPS022B January 2012  – March 2015 DLP3000


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration And Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Storage Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Measurement Conditions
    9. 6.9 Typical Characteristics
    10. 6.10System Mounting Interface Loads
    11. 6.11Micromirror Array Physical Characteristics
    12. 6.12Micromirror Array Optical Characteristics
    13. 6.13Window Characteristics
    14. 6.14Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
    4. 7.4Device Functional Modes
    5. 7.5Window Characteristics and Optics
      1. 7.5.1Optical Interface and System Image Quality
      2. 7.5.2Numerical Aperture and Stray Light Control
      3. 7.5.3Pupil Match
      4. 7.5.4Illumination Overfill
    6. 7.6Micromirror Array Temperature Calculation
    7. 7.7Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3Landed Duty Cycle and Operational Array Temperature
      4. 7.7.4Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1Application Information
    2. 8.2Typical Application
      1. 8.2.1Design Requirements
      2. 8.2.2Detailed Design Procedure
      3. 8.2.3Application Curve
  9. Power Supply Recommendations
    1. 9.1DMD Power Supply Requirements
    2. 9.2DMD Power Supply Power-Up Procedure
    3. 9.3DMD Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1Layout Guidelines
      1. 10.1.1Printed Circuit Board Design Guidelines
      2. 10.1.2Printed Circuit Board Layer Stackup Geometry
      3. 10.1.3Signal Layers
      4. 10.1.4DMD Interfaces
        1. Digital Data
        2. Control Interface
        3. Micromirror Reset Control Interface
      5. 10.1.5Routing Constraints
      6. 10.1.6Termination Requirements
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Device Support
      1. 11.1.1Device Nomenclature
        1. Marking
    2. 11.2Documentation Support
      1. 11.2.1Related Documentation
    3. 11.3Trademarks
    4. 11.4Electrostatic Discharge Caution
    5. 11.5Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • FQB|50
Orderable Information

1 Features

  • 0.3-Inch (7.62 mm) Diagonal Micromirror Array
    • 608 × 684 Array of Aluminum, Micrometer-Sized Mirrors Offering up to WVGA Resolution (854 × 480) Wide Aspect Ratio Display
    • 7.6-µm Micromirror Pitch
    • ±12° Micromirror Tilt Angle (Relative to Flat State)
    • Side Illumination for Optimized Efficiency
    • 5-µs Micromirror Crossover Time
  • Highly Efficient in Visible Light (420 to 700 nm):
    • Window Transmission 97%
    • Micromirror Reflectivity 88%
    • Array Diffraction Efficiency 86%
    • Array Fill Factor 92%
    • Polarization Independent
  • Package Footprint of 16.6-mm × 7-mm × 4.6-mm
  • Low Power Consumption at 200 mW (Typical)
  • Dedicated DLPC300 Controller for Reliable Operation
  • Supports High-Speed Pattern Rates of 4000 Hz (Binary) and 120 Hz (8-Bit)
  • 15-Bit, Double Data Rate (DDR) Input Data Bus
  • 60- to 80-MHz Input Data Clock Rate
  • Integrated Micromirror Driver Circuitry
  • Supports 0°C to 70°C
  • Package Mates to PANASONIC AXT550224 Socket

2 Applications

  • Machine Vision
  • Industrial Inspection
  • 3D Scanning Such as Dental Scanners
  • 3D Optical Metrology
  • Automated Fingerprint Identification
  • Face Recognition
  • Augmented Reality
  • Embedded Display
  • Interactive Display
  • Information Overlay
  • Spectroscopy
  • Chemical Analyzers
  • Medical Instruments
  • Photo-Stimulation
  • Virtual Gauges

3 Description

The DLP3000 digital micromirror device (DMD) is a digitally-controlled micro-opto-electromechanical system (MOEMS) spatial light modulator (SLM) optimized for small form-factor applications. When coupled to an appropriate optical system, the DLP3000 can be used to modulate the amplitude and direction of incoming light.  The DLP3000 creates highly flexible light patterns with speed, precision, and efficiency.

Architecturally, the DLP3000 is a latchable, electrical-in/optical-out semiconductor device. This architecture makes the DLP3000 well-suited for use in applications such as 3D scanning or metrology with structured light, augmented reality, microscopy, medical instruments, and spectroscopy. The compact physical size of the DLP3000 is well-suited for portable equipment where small form factor and lower cost are important.  The compact package complements the small size of LEDs to enable highly-efficient, robust light engines.

The DLP3000 is one of two devices in the DLP® 0.3 WVGA chipset. Proper function and reliable operation of the DLP3000 requires that it be used in conjunction with the DLPC300 controller. See the DLP 0.3 WVGA chipset data sheet (DLPZ005) for further details.

Device Information(1)

DLP3000LCCC (50) 16.6 mm × 7.0 mm × 4.6 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Diagram

DLP3000 simp_app_block.gif

4 Revision History

Changes from A Revision (October 2012) to B Revision

  • Added ESD Ratings table, Storage Conditions table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed package thickness from 5.0mm to 4.6mm Go
  • Changed minimum temperature from -10°C to 0°C to match long term operational temperature range Go
  • Added package body size dimensions to Device Information tableGo
  • Changed DMD picture to simplified application block diagramGo
  • Changed image to a cleaner source file Go
  • Changed Absolute Maximum Ratings table to include operational temperatures and dew points Go
  • Changed the Recommended Operating Conditions table to include operating and non-operating temperature ranges, dew points, and the illumination power density Go
  • Added Max Recommended Array Temperature - Derating CurveGo
  • Added note to Thermal Information table Go
  • Added Bit Depth versus Pattern Rate table Go
  • Moved the Mechanical section from the Recommended Operating Conditions table to the System Mounting Interface Loads sectionGo
  • Added Window Characteristics section Go
  • Added Chipset Component Usage SpecificationGo
  • Added Overview in Detailed Description section Go
  • Added description of Functional Block Diagram interfacesGo
  • Changed formating of Thermal Characteristics, Package Thermal Resistance, Case Temperature, and Micromirror Array Temperature Calculation sectionsGo
  • Added Landed Duty Cycle and Operational DMD Temperature sectionGo

Changes from * Revision (January 2012) to A Revision

  • Corrected the CL2W constant value from: 0.00274 to 0.00293 W/lmGo