PMIC/LED Driver for DLP2010 (0.2 WVGA) DMD


Recommended alternative parts

  • DLPA2005  - The device has the SAME FUNCTIONALITY as the compared device, but is not pin-for-pin equivalent and may not be parametrically equivalent.   Similar to DLPA2000 but has LED driver current capacity of 2.4A


DLPA2000 is a dedicated PMIC/RGB LED/Lamp driver for the DLP2010 and DLP2010NIR Digital Micromirror Devices (DMD) when used with a DLPC3430, DLPC3435 or DLPC150 digital controller. For reliable operation of these chipsets, it is mandatory to use the DLPA2000.


  • High Efficiency RGB LED/Lamp Driver With Buck-
    Boost DC-to-DC Converter, DMD Supplies, DPP
    Core Supply, 1.8-V Load Switch, and
    Measurement System in a Small Chip-Scale
  • Three Low-Impedance (30 mΩ Typical at 27ΩC)
    MOSFET Switches for Channel Selection
  • Independent, 10-Bit Current Control per Channel
  • 750-mA Max LED Current for DLPA2000
    Embedded Applications
  • On-Chip Motor Driver
  • DMD Regulators
    • Requires Only a Single Inductor
    • VOFS: 10 V
    • VBIAS: 18 V
    • VRST: –14 V
    • Passive Discharge to GND When Disabled
  • DPP 1.1-V Core Supply
    • Synchronous Step-Down Converter With
      Integrated Switching FETs
    • Supports up to 600-mA Output Current
  • VLED Buck Boost Converter
    • Power Save Mode at Light Load Current
  • Low-Impedance Load Switch
    • VIN Range from 1.8 V to 3.6 V
    • Supports up to 200 mA of Current
    • Passive Discharge to GND When Disabled
  • DMD Reset Signal Generation and Power Supply
  • 33-MHz Serial Peripheral Interface (SPI)
  • Multiplexer for Measuring Analog Signals
    • Battery Voltage
    • LED Voltage, LED Current
    • Light Sensor (for White Point Correction)
    • Internal Reference Voltage
    • External (Thermistor) Temperature Sensor
  • Monitoring and Protection Circuits
    • Hot Die Warning and Thermal
    • Low-Battery Warning
    • Programmable Battery Undervoltage Lockout
    • Load Switch UVLO
    • Overcurrent and Undervoltage Protection
  • DLPA2000 DSBGA Package
    • 56-Ball 0.4-mm Pitch
    • Die Size: 3.280 mm × 3.484 mm ±0.03 mm

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Parametrics Compare all products in Pico Chipsets

Chipset Family
Component Type
Package Size: mm2:W x L (PKG)
PMIC/LED Driver   
See datasheet (DSBGA)