DS90CR218A

ACTIVE

+3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link Receiver - 85 MHz

Product details

Protocols Catalog Rating Catalog Operating temperature range (°C) -10 to 70
Protocols Catalog Rating Catalog Operating temperature range (°C) -10 to 70
TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • 12 to 85 MHz Shift Clock Support
  • 50% Duty Cycle on Receiver Output Clock
  • Low Power Consumption
  • ±1V Common-mode Range (Around +1.2V)
  • Narrow Bus Reduces Cable Size and Cost
  • Up to 1.785 Gbps Throughput
  • Up to 223 Mbytes/sec Bandwidth
  • 345 mV (typ) Swing LVDS Devices for Low EMI
  • PLL Requires No External Components
  • Rising Edge Data Strobe
  • Compatible with TIA/EIA-644 LVDS Standard
  • Low Profile 48-Lead TSSOP Package

All trademarks are the property of their respective owners.

  • 12 to 85 MHz Shift Clock Support
  • 50% Duty Cycle on Receiver Output Clock
  • Low Power Consumption
  • ±1V Common-mode Range (Around +1.2V)
  • Narrow Bus Reduces Cable Size and Cost
  • Up to 1.785 Gbps Throughput
  • Up to 223 Mbytes/sec Bandwidth
  • 345 mV (typ) Swing LVDS Devices for Low EMI
  • PLL Requires No External Components
  • Rising Edge Data Strobe
  • Compatible with TIA/EIA-644 LVDS Standard
  • Low Profile 48-Lead TSSOP Package

All trademarks are the property of their respective owners.

The DS90CR218A receiver deserializes three input LVDS data streams into 21 bits of CMOS/TTL output data. When operating at the maximum input clock rate of 85 Mhz, the LVDS data is received at 595 Mbps per data channel for a total data throughput of 1.785 Gbit/sec (233 Mbytes/sec).

The narrow bus and LVDS signalling of the DS90CR218A is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces.

The DS90CR218A receiver deserializes three input LVDS data streams into 21 bits of CMOS/TTL output data. When operating at the maximum input clock rate of 85 Mhz, the LVDS data is received at 595 Mbps per data channel for a total data throughput of 1.785 Gbit/sec (233 Mbytes/sec).

The narrow bus and LVDS signalling of the DS90CR218A is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 7
Type Title Date
* Data sheet DS90CR218A 3.3VRising Edge Data Strobe LVDS 21Bit Chan Link 12MHz to 85MHz datasheet (Rev. D) 22 Apr 2013
Application note High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs 09 Nov 2018
Application note Receiver Skew Margin for Channel Link I and FPD Link I Devices 13 Jan 2016
Application note AN-1538 Interfacing Nationals DS90CR218A and LM98714 (Rev. C) 26 Apr 2013
Design guide Channel Link I Design Guide 29 Mar 2007
Application note Multi-Drop Channel-Link Operation 04 Oct 2004
Application note CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications 05 Oct 1998

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

DS90CR218A IBIS Model

SNLM058.ZIP (5 KB) - IBIS Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Package Pins Download
TSSOP (DGG) 48 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos