SLVSDP5 June 2017 ESD122

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings—JEDEC Specification
    3. 6.3ESD Ratings—IEC Specification
    4. 6.4Recommended Operating Conditions
    5. 6.5Thermal Information
    6. 6.6Electrical Characteristics
    7. 6.7Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1 IEC 61000-4-2 ESD Protection
      2. 7.3.2 IEC 61000-4-4 EFT Protection
      3. 7.3.3 IEC 61000-4-5 Surge Protection
      4. 7.3.4 IO Capacitance
      5. 7.3.5 DC Breakdown Voltage
      6. 7.3.6 Ultra Low Leakage Current
      7. 7.3.7 Low ESD Clamping Voltage
      8. 7.3.8 Supports High Speed Interfaces
      9. 7.3.9 Industrial Temperature Range
      10. 7.3.10Easy Flow-Through Routing Package
    4. 7.4Device Functional Modes
  8. Application and Implementation
    1. 8.1Application Information
    2. 8.2Typical Applications
      1. 8.2.1USB 3.1 Gen 2 Application
        1. 8.2.1.1Design Requirements
        2. 8.2.1.2Detailed Design Procedure
          1. 8.2.1.2.1Signal Range
          2. 8.2.1.2.2Operating Frequency
        3. 8.2.1.3Application Curves
      2. 8.2.2HDMI 2.0 Application
        1. 8.2.2.1Design Requirements
        2. 8.2.2.2Detailed Design Procedure
          1. 8.2.2.2.1Signal Range
          2. 8.2.2.2.2Operating Frequency
        3. 8.2.2.3Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Examples
  11. 11Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Receiving Notification of Documentation Updates
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Features

  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch

Applications

  • End Equipment
    • Mobile and Tablets
    • Laptops and Desktops
    • Set-Top Boxes
    • TV and Monitors
    • Servers
  • Interfaces
    • USB Type-C
    • HDMI 2.0/1.4
    • USB 3.1 Gen 2/Gen1, USB 3.0, and USB 2.0
    • Thunderbolt-1 and Thunderbolt-2
    • Display Port 1.3
    • PCI Express 3.0
    • SATA

Description

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

Device Information(1)

PART NUMBERPACKAGEBODY SIZE (NOM)
ESD122X2SON (3) (DMX)0.60 mm × 1.00 mm
(DMY)0.60 mm × 1.32 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

USB Type C Application Example

ESD122 slvsdp5_app_block_diagram_firstpage.gif