F28M35M52C Concerto Microcontroller | TI.com

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Concerto Microcontroller


Recommended alternative parts

  • F28M35H52C  -  The device is an EXACT EQUIVALENT in functionality and peripherals to the compared device, with faster clock speeds.
  • TMS320F28388D  - The device has SIMILAR FUNCTIONALITY but is not functionally equivalent to the compared device. 


The Concerto family is a multicore system-on-chip microcontroller unit (MCU) with independent communication and real-time control subsystems. The F28M35x family of devices is the first series in the Concerto family.

The communications subsystem is based on the industry-standard 32-bit ARM Cortex-M3 CPU and features a wide variety of communication peripherals, including Ethernet 1588, USB OTG with PHY, Controller Area Network (CAN), UART, SSI, I2C, and an external interface.

The real-time control subsystem is based on TI’s industry-leading proprietary 32-bit C28x floating-point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures—all as implemented by TI’s TMS320C2000™ Piccolo™ and Delfino™ families. In addition, the C28-CPU has been enhanced with the addition of the VCU instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms.

A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), parity, and code secure memory, as well as documentation to assist with system-level industrial safety certification.


  • Master Subsystem — ARM® Cortex®-M3
    • Up to 100 MHz
    • Embedded Memory
      • Up to 512KB of Flash (ECC)
      • Up to 32KB of RAM (ECC or Parity)
      • Up to 64KB of Shared RAM
      • 2KB of IPC Message RAM
    • Five Universal Asynchronous Receiver/Transmitters (UARTs)
    • Four Synchronous Serial Interfaces (SSIs) and a Serial Peripheral Interface (SPI)
    • Two Inter-integrated Circuits (I2Cs)
    • Universal Serial Bus On-the-Go (USB-OTG) + PHY
    • 10/100 ENET 1588 MII
    • Two Controller Area Network, D_CAN, Modules (Pin-Bootable)
    • 32-Channel Micro Direct Memory Access (µDMA)
    • Dual Security Zones (128-Bit Password per Zone)
    • External Peripheral Interface (EPI)
    • Micro Cyclic Redundancy Check (µCRC) Module
    • Four General-Purpose Timers
    • Two Watchdog Timer Modules
    • Endianness: Little Endian
  • Clocking
    • On-chip Crystal Oscillator and External Clock Input
    • Dynamic Phase-Locked Loop (PLL) Ratio Changes Supported
  • 1.2-V Digital, 1.8-V Analog, 3.3-V I/O Design
  • Interprocessor Communications (IPC)
    • 32 Handshaking Channels
    • Four Channels Generate IPC Interrupts
    • Can be Used to Coordinate Transfer of Data Through IPC Message RAMs
  • Up to 74 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins
    • Glitch-free I/Os
  • Control Subsystem — TMS320C28x 32-Bit CPU
    • Up to 150 MHz
    • C28x Core Hardware Built-in Self-Test
    • Embedded Memory
      • Up to 512KB of Flash (ECC)
      • Up to 36KB of RAM (ECC or Parity)
      • Up to 64KB of Shared RAM
      • 2KB of IPC Message RAM
    • IEEE-754 Single-Precision Floating-Point Unit (FPU)
    • Viterbi, Complex Math, CRC Unit (VCU)
    • Serial Communications Interface (SCI)
    • SPI
    • I2C
    • 6-Channel Direct Memory Access (DMA)
    • Nine Enhanced Pulse Width Modulator (ePWM) Modules
      • 18 Outputs (16 High-Resolution)
    • Six 32-Bit Enhanced Capture (eCAP) Modules
    • Three 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
    • Multichannel Buffered Serial Port (McBSP)
    • EPI
    • One Security Zone (128-Bit Password)
    • Three 32-Bit Timers
    • Endianness: Little Endian
  • Analog Subsystem
    • Dual 12-Bit Analog-to-Digital Converters (ADCs)
    • Up to 2.88 MSPS
    • Up to 20 Channels
    • Four Sample-and-Hold (S/H) Circuits
    • Up to Six Comparators With 10-Bit Digital-to-Analog Converter (DAC)
  • Package
    • 144-Pin RFP PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP)
  • Temperature Options:
    • T: –40ºC to 105ºC Junction
    • S: –40ºC to 125ºC Junction
    • Q: –40ºC to 125ºC Free-Air
      (AEC Q100 Qualification for Automotive Applications)

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Compare all products in C2000 real-time control MCUs Email Download to Excel
Part number Order Total processing (MIPS) Frequency (MHz) Flash (KB) ADC resolution ADC (Ch) RAM (KB) Sigma-delta filter PWM (Ch) High-resolution PWM (ch) UART (SCI) I2C SPI CAN (#) DMA (Ch) QEP USB Operating temperature range (C) Approx. price (US$) Rating Package Group
F28M35M52C Order now 150     75     1024     12-bit     20     136     0     24     16     6     3     5     2     1 6-Ch DMA, 1 32-ch DMA     3     1     -40 to 105
-40 to 125    
11.66 | 1ku     Catalog     HTQFP | 144