SNOSCY5B August   2014  – April 2015 FDC1004

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristicsnote to Electrical Characteristics table
    6. 7.6 I2C Interface Voltage Level
    7. 7.7 I2C Interface Timing
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 The Shield
      2. 8.3.2 The CAPDAC
      3. 8.3.3 Capacitive System Offset Calibration
      4. 8.3.4 Capacitive Gain Calibration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single Ended Measurement
      2. 8.4.2 Differential Measurement
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Address
      2. 8.5.2 Read/Write Operations
      3. 8.5.3 Device Usage
        1. 8.5.3.1 Measurement Configuration
        2. 8.5.3.2 Triggering Measurements
        3. 8.5.3.3 Wait for Measurement Completion
        4. 8.5.3.4 Read of Measurement Result
    6. 8.6 Register Maps
      1. 8.6.1 Registers
        1. 8.6.1.1 Capacitive Measurement Registers
      2. 8.6.2 Measurement Configuration Registers
      3. 8.6.3 FDC Configuration Register
      4. 8.6.4 Offset Calibration Registers
      5. 8.6.5 Gain Calibration Registers
      6. 8.6.6 Manufacturer ID Register
      7. 8.6.7 Device ID Register
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Liquid Level Sensor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plot
    3. 9.3 Do's and Don'ts
    4. 9.4 Initialization Set Up
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Input Range: ±15 pF
  • Measurement Resolution: 0.5 fF
  • Maximum Offset Capacitance: 100 pF
  • Programmable Output Rates: 100/200/400 S/s
  • Maximum Shield Load: 400 pF
  • Supply Voltage: 3.3 V
  • Temp Range: –40° to 125°C
  • Current Consumption:
    • Active: 750 µA
    • Standby: 29 µA
  • Interface: I2C
  • Number of Channels: 4

2 Applications

  • Proximity Sensor
  • Gesture Recognition
  • Automotive Door / Kick Sensors
  • Automotive Rain Sensor
  • Remote and Direct Liquid Level Sensor
  • High-resolution Metal Profiling
  • Rain / Fog / Ice / Snow Sensor
  • Material Size Detection
  • Material Stack Height

3 Description

Capacitive sensing with grounded capacitor sensors is a very low-power, low-cost, high-resolution contact-less sensing technique that can be applied to a variety of applications ranging from proximity sensing and gesture recognition to material analysis and remote liquid level sensing. The sensor in a capacitive sensing system is any metal or conductor, allowing for low cost and highly flexible system design.

The FDC1004 is a high-resolution, 4-channel capacitance-to-digital converter for implementing capacitive sensing solutions. Each channel has a full scale range of ±15 pF and can handle a sensor offset capacitance of up to 100 pF, which can be either programmed internally or can be an external capacitor for tracking environmental changes over time and temperature. The large offset capacitance capability allows for the use of remote sensors.

The FDC1004 also includes shield drivers for sensor shields, which can reduce EMI interference and help focus the sensing direction of a capacitive sensor. The small footprint of the FDC1004 allows for use in space-constrained applications. The FDC1004 is available in a 10-pin WSON and VSSOP package and features an I2C interface for interfacing to an MCU.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
FDC1004 WSON (DSC) 3.0 mm x 3.0 mm
VSSOP (DGS) 3.0 mm x 3.0 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

4 Typical Application

FDC1004 new_fig01_snoscy5.gif