SNAS685A May   2016  – August 2016 HDC1010

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Electrical Characteristics
    7. 7.7 I2C Interface Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Consumption
      2. 8.3.2 Voltage Supply Monitoring
      3. 8.3.3 Heater
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
        1. 8.5.2.1 Serial Bus Address
        2. 8.5.2.2 Read and Write Operations
        3. 8.5.2.3 Device Measurement Configuration
    6. 8.6 Register Map
      1. 8.6.1 Temperature Register
      2. 8.6.2 Humidity Register
      3. 8.6.3 Configuration Register
      4. 8.6.4 Serial Number Registers
      5. 8.6.5 Manufacturer ID Register
      6. 8.6.6 Device Register ID
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Soldering
      2. 9.3.2 Chemical Exposure and Sensor Protection
      3. 9.3.3 High Temperature and Humidity Exposure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Surface Mount
      2. 11.1.2 Stencil Printing Process
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Relative Humidity Accuracy ±2% (typical)
  • Temperature Accuracy ±0.2°C (typical)
  • Excellent Stability at High Humidity
  • 14 Bit Measurement Resolution
  • 100 nA Sleep Mode Current
  • Average Supply Current:
    • 710 nA @ 1 sps, 11 bit RH Measurement
    • 1.3 µA @ 1 sps, 11 bit RH and Temperature Measurement
  • Supply Voltage 2.7 V to 5.5 V
  • Tiny 2 mm x 1.6 mm Device Footprint
  • I2C Interface

2 Applications

  • HVAC
  • IoT Smart Thermostats and Room Monitors
  • Refrigerators
  • Printers
  • White Goods
  • Medical Devices
  • Wireless Sensor (TIDA: 00374, 00484, 00524)

3 Description

The HDC1010 is a digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The HDC1010 operates over a wide supply range, and is a low cost, low power alternative to competitive solutions in a wide range of common applications. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1010 is placed on the bottom part of the device, which makes the HDC1010 more robust against dirt, dust, and other environmental contaminants. The humidity and temperature sensors are factory calibrated and the calibration data is stored in the on-chip non-volatile memory.

Device Information (1)

PART NUMBER PACKAGE BODY SIZE (NOM)
HDC1010 DSBGA (8-bump) 2.04 mm x 1.59 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Typical Application

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