SNAS685A
May 2016 – August 2016
HDC1010
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Typical Application
5
Revision History
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
I2C Interface Electrical Characteristics
7.7
I2C Interface Timing Requirements
7.8
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Power Consumption
8.3.2
Voltage Supply Monitoring
8.3.3
Heater
8.4
Device Functional Modes
8.5
Programming
8.5.1
I2C Serial Bus Address Configuration
8.5.2
I2C Interface
8.5.2.1
Serial Bus Address
8.5.2.2
Read and Write Operations
8.5.2.3
Device Measurement Configuration
8.6
Register Map
8.6.1
Temperature Register
8.6.2
Humidity Register
8.6.3
Configuration Register
8.6.4
Serial Number Registers
8.6.5
Manufacturer ID Register
8.6.6
Device Register ID
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
9.3
Do's and Don'ts
9.3.1
Soldering
9.3.2
Chemical Exposure and Sensor Protection
9.3.3
High Temperature and Humidity Exposure
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Surface Mount
11.1.2
Stencil Printing Process
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YPA|8
MXBG218
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snas685a_oa
snas685a_pm