SBOS790 April   2017 INA233

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Accuracy Analog-to-Digital Convertor (ADC)
      2. 7.3.2 Interleaved Power Calculation
      3. 7.3.3 Power Accumulator and Energy Measurement
      4. 7.3.4 I2C-, SMBus-, and PMBus-Compatible Digital Interface
      5. 7.3.5 Multiple Fault Event Reporting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous verses Triggered Operation
      2. 7.4.2 Device Shutdown
      3. 7.4.3 Averaging and Conversion Time Considerations
      4. 7.4.4 Filtering and Input Considerations
    5. 7.5 Programming
      1. 7.5.1 Default Settings
      2. 7.5.2 Calibration Register and Scaling
      3. 7.5.3 Reading and Writing Telemetry Data and Warning Thresholds
      4. 7.5.4 Reading Telemetry Data and Warning Thresholds
        1. 7.5.4.1 Writing Telemetry Data and Warning Thresholds
      5. 7.5.5 System-Level Calibration With MFR_CALIRATION Command
      6. 7.5.6 Bus Overview
        1. 7.5.6.1 Serial Bus Address
        2. 7.5.6.2 Serial Interface
        3. 7.5.6.3 Writing to and Reading From the INA233
          1. 7.5.6.3.1 Packet Error Checking
          2. 7.5.6.3.2 Bus Timing Requirements
        4. 7.5.6.4 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1 PMBus Command Support
      2. 7.6.2 Standard PMBus Commands
        1. 7.6.2.1  CLEAR_FAULTS (03h)
        2. 7.6.2.2  RESTORE_DEFAULT_ALL (12h)
        3. 7.6.2.3  CAPABILITY (19h)
        4. 7.6.2.4  IOUT_OC_WARN_LIMIT (4Ah) [default = 01111111 11111000]
        5. 7.6.2.5  VIN_OV_WARN_LIMIT (57h) [default = 01111111 11111000]
        6. 7.6.2.6  VIN_UV_WARN_LIMIT (58h) [default = 00000000 00000000]
        7. 7.6.2.7  PIN_OP_WARN_LIMIT (6Bh) [default = 11111111 11110000]
        8. 7.6.2.8  STATUS_BYTE (78h)
        9. 7.6.2.9  STATUS_WORD (79h)
        10. 7.6.2.10 STATUS_IOUT (7Bh)
        11. 7.6.2.11 STATUS_INPUT (7Ch)
        12. 7.6.2.12 STATUS_CML (7Eh)
        13. 7.6.2.13 STATUS_MFR_SPECIFIC (80h)
        14. 7.6.2.14 READ_EIN (86h)
        15. 7.6.2.15 READ_VIN (88h)
        16. 7.6.2.16 READ_IIN (89h)
        17. 7.6.2.17 READ_VOUT (8Bh)
        18. 7.6.2.18 READ_IOUT (8Ch, R)
        19. 7.6.2.19 READ_POUT (96h, R)
        20. 7.6.2.20 READ_PIN (97h, R)
        21. 7.6.2.21 MFR_ID (99h)
        22. 7.6.2.22 MFR_MODEL (9Ah)
        23. 7.6.2.23 MFR_REVISION (9Bh)
      3. 7.6.3 Manufacturer-Specific PMBus Commands
        1. 7.6.3.1 MFR_ADC_CONFIG (D0h) [default = 01000001 00100111]
        2. 7.6.3.2 MFR_READ_VSHUNT (D1h) [default = 00000000 00000000]
        3. 7.6.3.3 MFR_ALERT_MASK (D2h) [default = XXXXXXXX 11110000]
        4. 7.6.3.4 MFR_CALIBRATION (D4h) [default = 00000000 00000001]
        5. 7.6.3.5 MFR_DEVICE_CONFIG (D5h) [default = 00000010]
        6. 7.6.3.6 5.1.1 CLEAR_EIN (D6h)
        7. 7.6.3.7 TI_MFR_ID (E0h) [value = 01010100 01001001]
        8. 7.6.3.8 TI_MFR_MODEL (E1h) [value = 00110011 00110011]
        9. 7.6.3.9 TI_MFR_REVISION (E2h) [value = 01000001 00110000]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Calibration Register
        2. 8.2.2.2 Calculating PMBus Coefficients
        3. 8.2.2.3 Programming Warning Thresholds
        4. 8.2.2.4 Calculating Returned Telemetry Values
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

Current Shunt Monitor with Transient Robustness Reference Design

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.