SLLSEY2E March 2017  – November 2017 ISOW7840 , ISOW7841 , ISOW7842 , ISOW7843 , ISOW7844

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Ratings
    6. 7.6 Insulation Specifications
    7. 7.7 Safety-Related Certifications
    8. 7.8 Safety Limiting Values
    9. 7.9 Electrical Characteristics—5-V Input, 5-V Output
    10. 7.10Supply Current Characteristics—5-V Input, 5-V Output
    11. 7.11Electrical Characteristics—5-V Input, 3.3-V Output
    12. 7.12Supply Current Characteristics—5-V Input, 3.3-V Output
    13. 7.13Electrical Characteristics—3.3-V Input, 3.3-V Output
    14. 7.14Supply Current Characteristics—3.3-V Input, 3.3-V Output
    15. 7.15Switching Characteristics—5-V Input, 5-V Output
    16. 7.16Switching Characteristics—5-V Input, 3.3-V Output
    17. 7.17Switching Characteristics—3.3-V Input, 3.3-V Output
    18. 7.18Insulation Characteristics Curves
    19. 7.19Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1Overview
    2. 9.2Functional Block Diagram
    3. 9.3Feature Description
      1. 9.3.1Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2Power-Up and Power-Down Behavior
      3. 9.3.3Current Limit, Thermal Overload Protection
    4. 9.4Device Functional Modes
      1. 9.4.1Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1Application Information
    2. 10.2Typical Application
      1. 10.2.1Design Requirements
      2. 10.2.2Detailed Design Procedure
      3. 10.2.3Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1Layout Guidelines
      1. 12.1.1PCB Material
    2. 12.2Layout Example
  13. 13Device and Documentation Support
    1. 13.1Device Support
      1. 13.1.1Development Support
    2. 13.2Documentation Support
      1. 13.2.1Related Documentation
    3. 13.3Related Links
    4. 13.4Receiving Notification of Documentation Updates
    5. 13.5Community Resources
    6. 13.6Trademarks
    7. 13.7Electrostatic Discharge Caution
    8. 13.8Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DWE|16
Orderable Information

Device and Documentation Support

Documentation Support

Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.