SNOSCX2C September 2013  – September 2015 LDC1000


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Condition
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Timing Requirements
    7. 6.7Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Inductive Sensing
      2. 7.3.2Measuring RP With LDC1000
      3. 7.3.3Measuring Inductance With LDC1000
    4. 7.4Device Functional Modes
      1. 7.4.1Power Modes
      2. 7.4.2INTB Pin Modes
        1. Mode
        2. Mode
        3. Mode
    5. 7.5Programming
      1. 7.5.1SPI Description
        1. SPI Transactions
    6. 7.6Register Maps
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Calculation of RP_MIN and RP_MAX
      2. 8.1.2Output Data Rate
      3. 8.1.3Choosing Filter Capacitor (CFA and CFB Pins)
    2. 8.2Typical Application
      1. 8.2.1Axial Distance Sensing Using a PCB Sensor With LDC1000
        1. Requirements
        2. Design Procedure
          1. and Target
          2. Sensor Capacitor
          3. Filter Capacitor
          4. RP_MIN and RP_MAX
          5. Minimum Sensor Frequency
        3. Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Documentation Support (if applicable)
      1. 11.1.1Related Documentation
    2. 11.2Community Resources
    3. 11.3Trademarks
    4. 11.4Electrostatic Discharge Caution
    5. 11.5Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Orderable Information

1 Features

  • Magnet-Free Operation
  • Sub-Micron Precision
  • Adjustable Sensing Range (Through Coil Design)
  • Lower System Cost
  • Remote Sensor Placement (Decoupling the LDC From Harsh Environments)
  • High Durability (by Virtue of Contact-Less Operation)
  • Insensitivity to Environmental Interference (Such as Dirt, Dust, Water, Oil)
  • Supply Voltage, Analog: 4.75 V to 5.25 V
  • Supply Voltage, I/O: 1.8 V to 5.25 V
  • Supply Current (Without LC Tank): 1.7 mA
  • RP Resolution: 16-Bit
  • L Resolution: 24-Bit
  • LC Frequency Range: 5 kHz to 5 MHz

2 Applications

  • Position Sensing
  • Motion Sensing
  • Gear-Tooth Counting
  • Flow Meters
  • Push-Button Switches
  • Multi-Function Printers
  • Digital Cameras
  • Medical Devices

3 Description

Inductive Sensing is a contact-less, short-range sensing technology that enables low-cost, high-resolution sensing of conductive targets in the presence of dust, dirt, oil, and moisture, making it extremely reliable in hostile environments. Using a coil which can be created on a PCB as a sensing element, the LDC1000 enables ultra-low cost system solutions.

Inductive sensing technology enables precise measurement of linear and angular position, displacement, motion, compression, vibration, metal composition, and several other applications in markets including automotive, consumer, computer, industrial, medical, and communications. Inductive sensing offers better performance and reliability at lower cost than other competitive solutions.

The LDC1000 is the world’s first inductance-to-digital converter, offering the benefits of inductive sensing in a low-power, small-footprint solution. The product is available in a SON-16 package and offers several modes of operation. A serial peripheral interface (SPI) simplifies connection to an MCU.

Device Information(1)

LDC1000 WSON (16)5.00 mm × 4.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Axial Distance Sensing Application

LDC1000 axial_distanse_measuring_nograph_snoscx2.png

4 Revision History

Changes from B Revision (March 2015) to C Revision

  • Changed XOUT pin description to clarify proper crystal connectionGo
  • Added instructions on proper DAP connectionGo
  • Added conditions for L measurement resolutionGo
  • Changed TYP to NOMGo
  • Changed Some descriptions of device functionality for better clarity and consistency Go
  • Changed RP Conversion equation for clarity Go
  • Added extended SPI transaction figure for clarity Go
  • Changed Register maps to include Clock Configuration and Threshold Registers Go
  • Changed description of Min Sensor frequency for clarity Go
  • Added documentation of registers 0x05, 0x06, and 0x08 Go
  • Changed description of OSC Status to include possible causes. Go
  • Changed some details on Application Information for improved clarity and consistency. Go
  • Deleted lateral and rotation images from example applications, as example application details axial sensing configurationGo
  • Changed details of example design for improved clarityGo

Changes from A Revision (December 2013) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed SCLK Pin type from DO to DIGo
  • Added L Res value to Electrical CharacteristicsGo
  • Added Measuring Inductance With LDC1000 subsection to Feature DescriptionGo
  • Changed Frequency Counter Data values in Register Description tableGo

Changes from * Revision (September 2013) to A Revision

  • Changed SCLK to CSBGo