SLVS569F January   2005  – August 2015 LM2575

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Feedback Connection
      2. 7.3.2 ON/OFF Input
      3. 7.3.3 Fault Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation Mode
      2. 7.4.2 Standby Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Input Capacitor (CIN)
        2. 8.2.2.2  Output Capacitor (COUT)
        3. 8.2.2.3  Catch Diode
        4. 8.2.2.4  Inductor
        5. 8.2.2.5  Output Voltage Ripple and Transients
        6. 8.2.2.6  Feedback Connection
        7. 8.2.2.7  ON/OFF Input
        8. 8.2.2.8  Grounding
        9. 8.2.2.9  Reverse Current Considerations
        10. 8.2.2.10 Buck Regulator Design Procedure
        11. 8.2.2.11 Inductor Selection Guide
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Supply voltage –0.3 42 V
ON/OFF pin input voltage –0.3 VIN V
Output voltage to GND (steady-state) –1 V
TJ Maximum junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Supply voltage 4.75 40 V
TJ Operating virtual junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM2575 UNIT
N (PDIP)
16 PINS
RθJA Junction-to-ambient thermal resistance 67 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

ILOAD = 200 mA, VIN = 12 V (unless otherwise noted) (see Figure 16)
PARAMETER TEST CONDITIONS TJ MIN TYP MAX UNIT
VOUT Feedback voltage VOUT = 5 V, ILOAD = 0.2 A 25°C 1.217 1.23 1.243 V
8 V ≤ VIN ≤ 40 V, VOUT = 5 V,
0.2 A ≤ ILOAD ≤ 1 A		 25°C 1.193 1.23 1.267
Full range 1.18 1.28
η Efficiency VIN = 12 V, VOUT = 5 V, ILOAD = 1 A 25°C 77%
IIB Feedback bias current VOUT = 5 V 25°C 50 100 nA
Full range 500
fo Oscillator frequency(1) 25°C 47 52 58 kHz
Full range 42 63
VSAT Saturation voltage IOUT = 1 A(2) 25°C 0.9 1.2 V
Full range 1.4
Maximum duty cycle(3) 25°C 93% 98%
ICL Peak current(1)(2) 25°C 1.7 2.8 3.6 A
Full range 1.3 4
IL Output leakage current VIN = 40(4), Output = 0 V 25°C 2 mA
VIN = 40(4), Output = –1 V 7.5 30
IQ Quiescent current(4) 25°C 5 10 mA
ISTBY Standby quiescent current OFF (ON/OFF pin = 5 V) 25°C 50 200 μA
VIH ON/OFF logic input level OFF (VOUT = 0 V) 25°C 2.2 1.4 V
Full range 2.4
VIL ON (VOUT = nominal voltage) 25°C 1.2 1
Full range 0.8
IIH ON/OFF input current OFF (ON/OFF pin = 5 V) 25°C 12 30 μA
IIL ON (ON/OFF pin = 0 V) 0 10
(1) In the event of an output short or an overload condition, self-protection features lower the oscillator frequency to ∼18 kHz and the minimum duty cycle from 5% to ∼2%. The resulting output voltage drops to ∼40% of its nominal value, causing the average power dissipated by the IC to lower.
(2) Output is not connected to diode, inductor, or capacitor. Output is sourcing current.
(3) Feedback is disconnected from output and connected to 0 V.
(4) To force the output transistor off, FEEDBACK is disconnected from output and connected to 12 V.

6.6 Typical Characteristics

LM2575 g_norm_out_v.gifFigure 1. Normalized Output Voltage
LM2575 g_dropout_v.gifFigure 3. Dropout Voltage
LM2575 g_quiesc_curr.gifFigure 5. Quiescent Current
LM2575 g_norm_osc_f.gifFigure 7. Oscillator Frequency
LM2575 gx_min_op_vcc.gifFigure 9. Minimum Operating Voltage
LM2575 g_line_reg_adj.gifFigure 2. Line Regulation
LM2575 g_curr_limit.gifFigure 4. Current Limit
LM2575 g_stby_curr.gifFigure 6. Standby Quiescent Current
LM2575 g_sw_sat_v.gifFigure 8. Switch Saturation Voltage
LM2575 LM2575Bias.gifFigure 10. FEEDBACK Current