Home Power management AC/DC & DC/DC converters (integrated FET)
Home
Power management
AC/DC & DC/DC converters (integrated FET)

LM3209-G3

ACTIVE

Seamless Transition Buck-Boost DC/DC regulator for RF Power Amplifiers

Order now
Data sheet

LM3209-G3

ACTIVE
Data sheet Order now

Product details

Iout (max) (A) 1 Vin (min) (V) 2.7 Vin (max) (V) 5.5 Topology Buck Type Converter Switching frequency (min) (kHz) 2100 Switching frequency (max) (kHz) 2700 Features Enable, Output discharge, Over Current Protection, Soft Start Fixed, Synchronous Rectification, UVLO Fixed, UVLO fixed Control mode current mode Vout (min) (V) 0.6 Vout (max) (V) 4.2 Rating Catalog Operating temperature range (°C) -30 to 85
Iout (max) (A) 1 Vin (min) (V) 2.7 Vin (max) (V) 5.5 Topology Buck Type Converter Switching frequency (min) (kHz) 2100 Switching frequency (max) (kHz) 2700 Features Enable, Output discharge, Over Current Protection, Soft Start Fixed, Synchronous Rectification, UVLO Fixed, UVLO fixed Control mode current mode Vout (min) (V) 0.6 Vout (max) (V) 4.2 Rating Catalog Operating temperature range (°C) -30 to 85
DSBGA (YZR) 12 3.9375 mm² 2.25 x 1.75
  • Operates From a Single Li-Ion Cell:
    2.7V to 5.5V
  • Adjustable Output Voltage: 0.6V to 4.2V
  • 1A Maximum Load Capability for VIN ≥
    3.2V, VOUT = 3.6V
  • 2.4 MHz (typ.) Switching Frequency
  • Seamless Buck-Boost Mode Transition
  • Fast Output Voltage Transition: 0.8V to 4.0V in 20 µs
  • High-Efficiency: 95% typ. at 3.7 VIN, 3.5
    VOUT, at 300 mA
  • Cycle-by-cycle Over-Current Limit
  • Output Over-Voltage Clamp
  • Internal Compensation
  • 12-bump DSBGA Package
  • Operates From a Single Li-Ion Cell:
    2.7V to 5.5V
  • Adjustable Output Voltage: 0.6V to 4.2V
  • 1A Maximum Load Capability for VIN ≥
    3.2V, VOUT = 3.6V
  • 2.4 MHz (typ.) Switching Frequency
  • Seamless Buck-Boost Mode Transition
  • Fast Output Voltage Transition: 0.8V to 4.0V in 20 µs
  • High-Efficiency: 95% typ. at 3.7 VIN, 3.5
    VOUT, at 300 mA
  • Cycle-by-cycle Over-Current Limit
  • Output Over-Voltage Clamp
  • Internal Compensation
  • 12-bump DSBGA Package

The LM3209-G3 is buck-boost DC/DC converter designed to generate output voltages above or below a given input voltage. It is particularly suitable for single-cell Li-ion batteries for portable applications.

The LM3209-G3 operates at a 2.4 MHz typical switching frequency in full synchronous operation providing seamless transitions between buck and boost operating modes.

The power converter topology needs only one external inductor and two capacitors. Five internal power switches enable high overall efficiency.

The LM3209-G3 is internally compensated for buck and boost modes of operation, thus providing an optimal transient response.

The LM3209-G3 is available in an 12-bump lead-free DSBGA package of size 2.0 mm × 2.5 mm × 0.6 mm.

The LM3209-G3 is buck-boost DC/DC converter designed to generate output voltages above or below a given input voltage. It is particularly suitable for single-cell Li-ion batteries for portable applications.

The LM3209-G3 operates at a 2.4 MHz typical switching frequency in full synchronous operation providing seamless transitions between buck and boost operating modes.

The power converter topology needs only one external inductor and two capacitors. Five internal power switches enable high overall efficiency.

The LM3209-G3 is internally compensated for buck and boost modes of operation, thus providing an optimal transient response.

The LM3209-G3 is available in an 12-bump lead-free DSBGA package of size 2.0 mm × 2.5 mm × 0.6 mm.
open-in-new Find other AC/DC & DC/DC converters (integrated FET)
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 2
Type Title Date
* Data sheet LM3209-G3 Seamless-Transition Buck-Boost Cnvrtr for Batt- Powered 3G/4G RF PAs datasheet (Rev. B) 15 Mar 2013
Selection guide Power Management Guide 2018 (Rev. R) 25 Jun 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
DSBGA (YZR) 12 View options
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos