SNOSD60 June   2017 LMC6001-MIL

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 DC Electrical Characteristics for LMC6001AI
    6. 5.6 Dissipation Ratings
    7. 5.7 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Amplifier Topology
      2. 6.3.2 Latch-up Prevention
    4. 6.4 Device Functional Modes
  7. 7 Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Compensating for Input Capacitance
      2. 7.1.2 Capacitive Load Tolerance
    2. 7.2 Typical Application
      1. 7.2.1 Two Op Amp, Temperature Compensated Ph Probe Amplifier
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 System Example
      1. 7.3.1 Ultra-Low Input Current Instrumentation Amplifier
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Printed-Circuit-Board Layout For High-Impedance Work
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • Y|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Specifications

5.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX Unit
Differential Input Voltage ±Supply Voltage
Voltage at Input/Output Pin (V+) + 0.3 (V−) − 0.3 V
Supply Voltage (V+ − V−) −0.3 +16 V
Output Short Circuit to V+ See (3)(4)
Output Short Circuit to V− See (3)
Lead Temperature (Soldering, 10 Sec.) 260 °C
Junction Temperature 150 °C
Current at Input Pin ±10 mA
Current at Output Pin ±30 mA
Current at Power Supply Pin 40 mA
Storage Temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely affect reliability.
(4) Do not connect the output to V+, when V+ is greater than 13 V or reliability will be adversely affected.

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) Human body model, 1.5 kΩ in series with 100 pF.

5.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted).
MIN MAX UNIT
VSS Supply input voltage 4.5 15.5 V
TJ Operating junction temperature –40 85 °C

5.4 Thermal Information

THERMAL METRIC(1) LMC6001-MIL UNIT
P (PDIP) LMC (TO-99)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 100 145 °C/W
RθJC(top) Junction-to-case (top) thermal resistance — 45 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

5.5 DC Electrical Characteristics for LMC6001AI

Limits are ensured for TJ = 25°C unless otherwise specified. Unless otherwise specified, V+ = 5 V, V− = 0 V, VCM = 1.5 V, and RL > 1 M.
PARAMETER TEST CONDITIONS LMC6001AI UNIT
MIN(2) TYP(1) MAX(2)
IB Input Current Either Input, VCM = 0 V, VS = ±5 V 10 25 fA
At the temperature extremes 2000
IOS Input Offset Current 5
At the temperature extremes 1000
VOS Input Offset Voltage 0.7 mV
At the temperature extremes 1
VS = ±5 V, VCM = 0 V 10
At the temperature extremes 1.35
TCVOS Input Offset Voltage Drift 2.5 µV/°C
RIN Input Resistance >1 TΩ
CMRR Common Mode 0 V ≤ VCM ≤ 7.5 V 75 83 dB
Rejection Ratio V+ = 10 V At the temperature extremes 72
+PSRR Positive Power Supply Rejection Ratio 5 V ≤ V+ ≤ 15 V 73 83
At the temperature extremes 70
−PSRR Negative Power Supply Rejection Ratio 0 V ≥ V− ≥ −10 V 80 94
At the temperature extremes 77
AV Large Signal Voltage Gain Sourcing, RL = 2 kΩ(3) 400 1400 V/mV
300
Sinking, RL = 2 kΩ(3) 180 350
At the temperature extremes 100
VCM Input Common-Mode Voltage V+ = 5 V and 15 V For CMRR ≥ 60 dB VCM Low –0.4 –0.1 V
At the temperature extremes 0
VCM High V+ − 2.3 V+ − 1.9
At the temperature extremes V+ − 2.5
VO Output Swing V+ = 15 V, RL = 2 kΩ to 2.5 V VO Low 0.1 0.14 V
At the temperature extremes 0.17
VO High 4.8 4.87
At the temperature extremes 4.73
V+ = 15 V, RL = 2 kΩ to 7.5 V VO Low 0.26 0.35
At the temperature extremes 0.45
VO High 14.5 14.63
At the temperature extremes 14.34
IO Output Current Sourcing, V+ = 5 V,
VO = 0 V		 16 22 mA
At the temperature extremes 10
Sinking, V+ = 5 V,
VO = 5 V		 16 21
At the temperature extremes 13
Sourcing, V+ = 15 V,
VO = 0 V		 28 30
At the temperature extremes 22
Sinking, V+ = 15 V,
VO = 13 V(4)		 28 34
At the temperature extremes 22
IS Supply Current V+ = 5 V, VO = 1.5 V 450 750 µA
At the temperature extremes 900
V+ = 15 V, VO = 7.5 V 550 850
At the temperature extremes 950
(1) Typical values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
(3) V+ = 15 V, VCM = 7.5 V and RL connected to 7.5 V. For Sourcing tests, 7.5 V ≤ VO ≤ 11.5 V. For Sinking tests, 2.5 V ≤ VO ≤ 7.5 V.
(4) Do not connect the output to V + , when V + is greater than 13 V or reliability will be adversely affected.

5.6 Dissipation Ratings

MIN MAX UNIT
Power Dissipation See (1)
(1) For operating at elevated temperatures the device must be derated based on the thermal resistance θJA with PD = (TJ − TA)/θJA.

5.7 Typical Characteristics

VS = ±7.5 V, TA = 25°C, unless otherwise specified
LMC6001-MIL 1188716.gif
Figure 1. Input Current vs. Temperature
LMC6001-MIL 1188718.png
Figure 3. Supply Current vs. Supply Voltage
LMC6001-MIL 1188720.png
Figure 5. Common-Mode Rejection Ratio vs. Frequency
LMC6001-MIL 1188722.png
Figure 7. Input Voltage Noise vs. Frequency
LMC6001-MIL 1188724.png
Figure 9. Output Characteristics Sourcing Current
LMC6001-MIL 1188726.png
Figure 11. Gain and Phase Response vs. Temperature (−55°C to +125°C)
LMC6001-MIL 1188728.png
Figure 13. Open-Loop Frequency Response
LMC6001-MIL 1188730.png
Figure 15. Inverting Large Signal Pulse Response
LMC6001-MIL 1188732.png
Figure 17. Noninverting Large Signal Pulse Response
LMC6001-MIL 1188717.png
VS = ±5 V
Figure 2. Input Current vs. VCM
LMC6001-MIL 1188719.png
Figure 4. Input Voltage vs. Output Voltage
LMC6001-MIL 1188721.png
Figure 6. Power Supply Rejection Ratio vs. Frequency
LMC6001-MIL 1188723.png
Figure 8. Noise Figure vs. Source Resistance
LMC6001-MIL 1188725.png
Figure 10. Output Characteristics Sinking Current
LMC6001-MIL 1188727.png
RL = 500 kω
Figure 12. Gain and Phase Response vs. Capacitive Load
LMC6001-MIL 1188729.png
Figure 14. Inverting Small Signal Pulse Response
LMC6001-MIL 1188731.png
Figure 16. Noninverting Small Signal Pulse Response
LMC6001-MIL 1188733.png
Figure 18. Stability vs. Capacitive Load