SBOS709A July   2016  – July 2016 LMH2832

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: SPI
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Setup Diagrams
    2. 8.2 ATE Testing and DC Measurements
    3. 8.3 Frequency Response
    4. 8.4 Distortion
    5. 8.5 Noise Figure
    6. 8.6 Pulse Response, Slew Rate, and Overdrive Recovery
    7. 8.7 Power-Down
    8. 8.8 Crosstalk, Gain Matching, and Phase Matching
    9. 8.9 Output Measurement Reference Points
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input Characteristics
      2. 9.3.2 Analog Output Characteristics
      3. 9.3.3 Driving Low Insertion-Loss Filters
      4. 9.3.4 Input Impedance Matching
      5. 9.3.5 Power-On Reset (POR)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down (PD)
      2. 9.4.2 Gain Control
    5. 9.5 Programming
      1. 9.5.1 Details of the Serial Interface
      2. 9.5.2 Timing Diagrams
    6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1 SW Reset Register (address = 2)
      2. 9.6.2 Power-Down Control Register (address = 3)
      3. 9.6.3 Channel A RW0 Register (address = 4)
      4. 9.6.4 Channel A RW1 Register (address = 5)
      5. 9.6.5 Channel B RW0 Register (address = 6)
      6. 9.6.6 Channel B RW1 Register (address = 7)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving ADCs
        1. 10.1.1.1 SNR Considerations
        2. 10.1.1.2 SFDR Considerations
        3. 10.1.1.3 ADC Input Common-Mode Voltage Considerations (AC-Coupled Input)
        4. 10.1.1.4 ADC Input Common-Mode Voltage Considerations (DC-Coupled Input)
    2. 10.2 Typical Applications
      1. 10.2.1 DOCSIS 3.X Driver
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Source Resistance Matching
          2. 10.2.1.2.2 Output Impedance Matching
          3. 10.2.1.2.3 Voltage Headroom Considerations
        3. 10.2.1.3 Application Curve
      2. 10.2.2 IQ Receiver
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Do:
      2. 10.3.2 Don't:
  11. 11Power Supply Recommendations
    1. 11.1 Split Supplies
    2. 11.2 Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Device Nomenclature

LMH2832 device_markings_sbos709.gif Figure 64. Device Marking Information

13.2 Documentation Support

13.2.1 Related Documentation

For related documentation see the following:

13.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 Trademarks

E2E is a trademark of Texas Instruments.

Keysight Technologies is a trademark of Keysight Technologies.

SPI is a trademark of Motorola Mobility LLC.

All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.