SBOS709A
July 2016 – July 2016
LMH2832
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: SPI
7.7
Typical Characteristics
8
Parameter Measurement Information
8.1
Setup Diagrams
8.2
ATE Testing and DC Measurements
8.3
Frequency Response
8.4
Distortion
8.5
Noise Figure
8.6
Pulse Response, Slew Rate, and Overdrive Recovery
8.7
Power-Down
8.8
Crosstalk, Gain Matching, and Phase Matching
8.9
Output Measurement Reference Points
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Analog Input Characteristics
9.3.2
Analog Output Characteristics
9.3.3
Driving Low Insertion-Loss Filters
9.3.4
Input Impedance Matching
9.3.5
Power-On Reset (POR)
9.4
Device Functional Modes
9.4.1
Power-Down (PD)
9.4.2
Gain Control
9.5
Programming
9.5.1
Details of the Serial Interface
9.5.2
Timing Diagrams
9.6
Register Maps
9.6.1
Register Descriptions
9.6.1.1
SW Reset Register (address = 2)
9.6.2
Power-Down Control Register (address = 3)
9.6.3
Channel A RW0 Register (address = 4)
9.6.4
Channel A RW1 Register (address = 5)
9.6.5
Channel B RW0 Register (address = 6)
9.6.6
Channel B RW1 Register (address = 7)
10
Application and Implementation
10.1
Application Information
10.1.1
Driving ADCs
10.1.1.1
SNR Considerations
10.1.1.2
SFDR Considerations
10.1.1.3
ADC Input Common-Mode Voltage Considerations (AC-Coupled Input)
10.1.1.4
ADC Input Common-Mode Voltage Considerations (DC-Coupled Input)
10.2
Typical Applications
10.2.1
DOCSIS 3.X Driver
10.2.1.1
Design Requirements
10.2.1.2
Detailed Design Procedure
10.2.1.2.1
Source Resistance Matching
10.2.1.2.2
Output Impedance Matching
10.2.1.2.3
Voltage Headroom Considerations
10.2.1.3
Application Curve
10.2.2
IQ Receiver
10.3
Do's and Don'ts
10.3.1
Do:
10.3.2
Don't:
11
Power Supply Recommendations
11.1
Split Supplies
11.2
Supply Decoupling
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Device Support
13.1.1
Device Nomenclature
13.2
Documentation Support
13.2.1
Related Documentation
13.3
Receiving Notification of Documentation Updates
13.4
Community Resources
13.5
Trademarks
13.6
Electrostatic Discharge Caution
13.7
Glossary
14
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RHA|40
MPQF135D
Thermal pad, mechanical data (Package|Pins)
RHA|40
QFND115P
Orderable Information
sbos709a_oa
sbos709a_pm