SBOS709A July   2016  – July 2016 LMH2832

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: SPI
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Setup Diagrams
    2. 8.2 ATE Testing and DC Measurements
    3. 8.3 Frequency Response
    4. 8.4 Distortion
    5. 8.5 Noise Figure
    6. 8.6 Pulse Response, Slew Rate, and Overdrive Recovery
    7. 8.7 Power-Down
    8. 8.8 Crosstalk, Gain Matching, and Phase Matching
    9. 8.9 Output Measurement Reference Points
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input Characteristics
      2. 9.3.2 Analog Output Characteristics
      3. 9.3.3 Driving Low Insertion-Loss Filters
      4. 9.3.4 Input Impedance Matching
      5. 9.3.5 Power-On Reset (POR)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down (PD)
      2. 9.4.2 Gain Control
    5. 9.5 Programming
      1. 9.5.1 Details of the Serial Interface
      2. 9.5.2 Timing Diagrams
    6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1 SW Reset Register (address = 2)
      2. 9.6.2 Power-Down Control Register (address = 3)
      3. 9.6.3 Channel A RW0 Register (address = 4)
      4. 9.6.4 Channel A RW1 Register (address = 5)
      5. 9.6.5 Channel B RW0 Register (address = 6)
      6. 9.6.6 Channel B RW1 Register (address = 7)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving ADCs
        1. 10.1.1.1 SNR Considerations
        2. 10.1.1.2 SFDR Considerations
        3. 10.1.1.3 ADC Input Common-Mode Voltage Considerations (AC-Coupled Input)
        4. 10.1.1.4 ADC Input Common-Mode Voltage Considerations (DC-Coupled Input)
    2. 10.2 Typical Applications
      1. 10.2.1 DOCSIS 3.X Driver
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Source Resistance Matching
          2. 10.2.1.2.2 Output Impedance Matching
          3. 10.2.1.2.3 Voltage Headroom Considerations
        3. 10.2.1.3 Application Curve
      2. 10.2.2 IQ Receiver
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Do:
      2. 10.3.2 Don't:
  11. 11Power Supply Recommendations
    1. 11.1 Split Supplies
    2. 11.2 Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Power Supply Recommendations

The LMH2832 is designed to be used with a single supply with a range of 4.75 V to 5.25 V. The ideal supply voltage is a 5.0-V total single-ended supply. If the supply is reduced to the minimum voltage, then the maximum input and output voltage range is reduced by 0.25 V.

11.1 Split Supplies

Ideally, the LMH2832 uses a single-ended, 5-V supply, but the device can be operated on a split supply if necessary. However, the digital logic is referenced to the GND pins, meaning that the logic reference shifts with the GND supply if connected to a negative voltage and must be accounted for in the logic connections. In general, the LMH2832 is not suggested to be operated with a split-supply configuration.

11.2 Supply Decoupling

Power-supply decoupling is critical to high-frequency performance. Onboard bypass capacitors are used on the LMH2832EVM; however, the most important component of the supply bypassing is provided by the printed circuit board (PCB). As illustrated in Figure 63, there are multiple vias connecting the LMH2832 power planes to the power-supply traces. These vias connect the internal power planes to the LMH2832. Both VCC and GND must be connected to the internal power planes with several square centimeters of continuous plane in the immediate vicinity of the amplifier. The capacitance between these power planes provides the bulk of the high-frequency bypassing for the LMH2832.