SBOS730A April 2015  – May 2015 LMH6401

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1Absolute Maximum Ratings
    2. 7.2ESD Ratings
    3. 7.3Recommended Operating Conditions
    4. 7.4Thermal Information
    5. 7.5Electrical Characteristics
    6. 7.6SPI Timing Requirements
    7. 7.7Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1Setup Diagrams
    2. 8.2Output Measurement Reference Points
    3. 8.3ATE Testing and DC Measurements
    4. 8.4Frequency Response
    5. 8.5Distortion
    6. 8.6Noise Figure
    7. 8.7Pulse Response, Slew Rate, and Overdrive Recovery
    8. 8.8Power Down
    9. 8.9VOCM Frequency Response
  9. Detailed Description
    1. 9.1Overview
    2. 9.2Functional Block Diagram
    3. 9.3Feature Description
    4. 9.4Device Functional Modes
      1. 9.4.1Power-On Reset (POR)
      2. 9.4.2Power-Down (PD)
      3. 9.4.3Thermal Feedback Control
      4. 9.4.4Gain Control
    5. 9.5Programming
      1. 9.5.1Details of the Serial Interface
      2. 9.5.2Timing Diagrams
    6. 9.6Register Maps
      1. 9.6.1Revision ID (address = 0h, Read-Only) [default = 03h]
      2. 9.6.2Product ID (address = 1h, Read-Only) [default = 00h]
      3. 9.6.3Gain Control (address = 2h) [default = 20h]
      4. 9.6.4Reserved (address = 3h) [default = 8Ch]
      5. 9.6.5Thermal Feedback Gain Control (address = 4h) [default = 27h]
      6. 9.6.6Thermal Feedback Frequency Control (address = 5h) [default = 45h]
  10. 10Application and Implementation
    1. 10.1Application Information
      1. 10.1.1Analog Input Characteristics
      2. 10.1.2 Analog Output Characteristics
        1. 10.1.2.1Driving Capacitive Loads
      3. 10.1.3Thermal Feedback Control
        1. 10.1.3.1Step Response Optimization using Thermal Feedback Control
      4. 10.1.4Thermal Considerations
    2. 10.2Typical Application
      1. 10.2.1Design Requirements
      2. 10.2.2Detailed Design Procedure
        1. 10.2.2.1Driving ADCs
          1. 10.2.2.1.1SNR Considerations
          2. 10.2.2.1.2SFDR Considerations
          3. 10.2.2.1.3ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
          4. 10.2.2.1.4ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
      3. 10.2.3Application Curves
    3. 10.3Do's and Don'ts
      1. 10.3.1Do:
      2. 10.3.2Don't:
  11. 11Power-Supply Recommendations
    1. 11.1Single-Supply Operation
    2. 11.2Split-Supply Operation
  12. 12Layout
    1. 12.1Layout Guidelines
    2. 12.2Layout Examples
  13. 13Device and Documentation Support
    1. 13.1Documentation Support
      1. 13.1.1Related Documentation
    2. 13.2Community Resources
    3. 13.3Trademarks
    4. 13.4Electrostatic Discharge Caution
    5. 13.5Glossary
  14. 14Mechanical, Packaging, and Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

  • ADS12D1800RF Data Sheet, SNAS518
  • ADC12J1600, ADC12J2700 Data Sheet, SLAS969
  • ADC12J4000 Data Sheet, SLAS989
  • ADS54J40 Data Sheet, SBAS714
  • ADS54J60 Data Sheet, SBAS706
  • LMH3401 Data Sheet, SBOS695
  • LMH5401 Data Sheet, SBOS710
  • LMH6517 Data Sheet, SNOSB19
  • LMH6521 Data Sheet, SNOSB47
  • LMH6554 Data Sheet, SNOSB30
  • LMH6881 Data Sheet, SNOSC72
  • LMR70503 Data Sheet, SNVS850
  • TPS72301 Data Sheet, SLVS346
  • AN-2188 Between the Amplifier and the ADC: Managing Filter Loss in Communications Systems, SNOA567
  • AN-2235 Circuit Board Design for LMH6517/21/22 and Other High-Speed IF/RF Feedback Amplifiers, SNOA869
  • LMH6401EVM Evaluation Module, SLOU406

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

E2E is a trademark of Texas Instruments.

Marki is a trademark of Marki Microwave, Inc.

SPI is a trademark of Motorola Mobility LLC.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.