SBOS730A April 2015  – May 2015 LMH6401

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1Absolute Maximum Ratings
    2. 7.2ESD Ratings
    3. 7.3Recommended Operating Conditions
    4. 7.4Thermal Information
    5. 7.5Electrical Characteristics
    6. 7.6SPI Timing Requirements
    7. 7.7Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1Setup Diagrams
    2. 8.2Output Measurement Reference Points
    3. 8.3ATE Testing and DC Measurements
    4. 8.4Frequency Response
    5. 8.5Distortion
    6. 8.6Noise Figure
    7. 8.7Pulse Response, Slew Rate, and Overdrive Recovery
    8. 8.8Power Down
    9. 8.9VOCM Frequency Response
  9. Detailed Description
    1. 9.1Overview
    2. 9.2Functional Block Diagram
    3. 9.3Feature Description
    4. 9.4Device Functional Modes
      1. 9.4.1Power-On Reset (POR)
      2. 9.4.2Power-Down (PD)
      3. 9.4.3Thermal Feedback Control
      4. 9.4.4Gain Control
    5. 9.5Programming
      1. 9.5.1Details of the Serial Interface
      2. 9.5.2Timing Diagrams
    6. 9.6Register Maps
      1. 9.6.1Revision ID (address = 0h, Read-Only) [default = 03h]
      2. 9.6.2Product ID (address = 1h, Read-Only) [default = 00h]
      3. 9.6.3Gain Control (address = 2h) [default = 20h]
      4. 9.6.4Reserved (address = 3h) [default = 8Ch]
      5. 9.6.5Thermal Feedback Gain Control (address = 4h) [default = 27h]
      6. 9.6.6Thermal Feedback Frequency Control (address = 5h) [default = 45h]
  10. 10Application and Implementation
    1. 10.1Application Information
      1. 10.1.1Analog Input Characteristics
      2. 10.1.2 Analog Output Characteristics
        1. 10.1.2.1Driving Capacitive Loads
      3. 10.1.3Thermal Feedback Control
        1. 10.1.3.1Step Response Optimization using Thermal Feedback Control
      4. 10.1.4Thermal Considerations
    2. 10.2Typical Application
      1. 10.2.1Design Requirements
      2. 10.2.2Detailed Design Procedure
        1. 10.2.2.1Driving ADCs
          1. 10.2.2.1.1SNR Considerations
          2. 10.2.2.1.2SFDR Considerations
          3. 10.2.2.1.3ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
          4. 10.2.2.1.4ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
      3. 10.2.3Application Curves
    3. 10.3Do's and Don'ts
      1. 10.3.1Do:
      2. 10.3.2Don't:
  11. 11Power-Supply Recommendations
    1. 11.1Single-Supply Operation
    2. 11.2Split-Supply Operation
  12. 12Layout
    1. 12.1Layout Guidelines
    2. 12.2Layout Examples
  13. 13Device and Documentation Support
    1. 13.1Documentation Support
      1. 13.1.1Related Documentation
    2. 13.2Community Resources
    3. 13.3Trademarks
    4. 13.4Electrostatic Discharge Caution
    5. 13.5Glossary
  14. 14Mechanical, Packaging, and Orderable Information

5 Device Options

Table 1. FDA Device Companion

DEVICEBW (AV = 12 dB)DISTORTIONNOISE
LMH54016.2 GHz–75-dBc HD2, –75-dBc HD3 at 500 MHz1.25 nV/√Hz
LMH34017 GHz, G = 16 dB–79-dBc HD2, –77-dBc HD3 at 500 MHz1.4 nV/√Hz
LMH65541.6 GHz–79-dBc HD2, –70-dBc HD3 at 250 MHz0.9 nV/√Hz

Table 2. DVGA Device Comparison

DEVICEMAX GAIN, BWDISTORTIONNOISE FIGURE
LMH651722 dB, 1.2 GHz43-dBm OIP3 at 200 MHz, –74-dBc HD3 at 200 MHz5.5 dB
LMH652126 dB, 1.2 GHz49-dBm OIP3 at 200 MHz, –84-dBc HD3 at 200 MHz7.3 dB
LMH688126 dB, 2.4 GHz42-dBm OIP3 at 200 MHz, –76-dBc HD3 at 200 MHz9.7 dB