SBOS730A April 2015  – May 2015 LMH6401

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1Absolute Maximum Ratings
    2. 7.2ESD Ratings
    3. 7.3Recommended Operating Conditions
    4. 7.4Thermal Information
    5. 7.5Electrical Characteristics
    6. 7.6SPI Timing Requirements
    7. 7.7Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1Setup Diagrams
    2. 8.2Output Measurement Reference Points
    3. 8.3ATE Testing and DC Measurements
    4. 8.4Frequency Response
    5. 8.5Distortion
    6. 8.6Noise Figure
    7. 8.7Pulse Response, Slew Rate, and Overdrive Recovery
    8. 8.8Power Down
    9. 8.9VOCM Frequency Response
  9. Detailed Description
    1. 9.1Overview
    2. 9.2Functional Block Diagram
    3. 9.3Feature Description
    4. 9.4Device Functional Modes
      1. 9.4.1Power-On Reset (POR)
      2. 9.4.2Power-Down (PD)
      3. 9.4.3Thermal Feedback Control
      4. 9.4.4Gain Control
    5. 9.5Programming
      1. 9.5.1Details of the Serial Interface
      2. 9.5.2Timing Diagrams
    6. 9.6Register Maps
      1. 9.6.1Revision ID (address = 0h, Read-Only) [default = 03h]
      2. 9.6.2Product ID (address = 1h, Read-Only) [default = 00h]
      3. 9.6.3Gain Control (address = 2h) [default = 20h]
      4. 9.6.4Reserved (address = 3h) [default = 8Ch]
      5. 9.6.5Thermal Feedback Gain Control (address = 4h) [default = 27h]
      6. 9.6.6Thermal Feedback Frequency Control (address = 5h) [default = 45h]
  10. 10Application and Implementation
    1. 10.1Application Information
      1. 10.1.1Analog Input Characteristics
      2. 10.1.2 Analog Output Characteristics
        1. 10.1.2.1Driving Capacitive Loads
      3. 10.1.3Thermal Feedback Control
        1. 10.1.3.1Step Response Optimization using Thermal Feedback Control
      4. 10.1.4Thermal Considerations
    2. 10.2Typical Application
      1. 10.2.1Design Requirements
      2. 10.2.2Detailed Design Procedure
        1. 10.2.2.1Driving ADCs
          1. 10.2.2.1.1SNR Considerations
          2. 10.2.2.1.2SFDR Considerations
          3. 10.2.2.1.3ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
          4. 10.2.2.1.4ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
      3. 10.2.3Application Curves
    3. 10.3Do's and Don'ts
      1. 10.3.1Do:
      2. 10.3.2Don't:
  11. 11Power-Supply Recommendations
    1. 11.1Single-Supply Operation
    2. 11.2Split-Supply Operation
  12. 12Layout
    1. 12.1Layout Guidelines
    2. 12.2Layout Examples
  13. 13Device and Documentation Support
    1. 13.1Documentation Support
      1. 13.1.1Related Documentation
    2. 13.2Community Resources
    3. 13.3Trademarks
    4. 13.4Electrostatic Discharge Caution
    5. 13.5Glossary
  14. 14Mechanical, Packaging, and Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.