SNOSB30P October 2008  – January 2015 LMH6554

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Typical Application Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1Absolute Maximum Ratings
    2. 7.2ESD Ratings
    3. 7.3Recommended Operating Conditions
    4. 7.4Thermal Information
    5. 7.5Electrical Characteristics: +5 V
    6. 7.6Typical Performance Characteristics VS = ±2.5 V
  8. Detailed Description
    1. 8.1Overview
    2. 8.2Functional Block Diagram
    3. 8.3Feature Description
    4. 8.4Device Functional Modes
  9. Application and Implementation
    1. 9.1Application Information
    2. 9.2Typical Applications
      1. 9.2.1Single-Ended Input to Differential Output Operation
        1. 9.2.1.1Design Requirements
        2. 9.2.1.2Detailed Design Procedure
          1. 9.2.1.2.1Enable / Disable Operation
          2. 9.2.1.2.2Single-Ended Input to Differential Output Operation
          3. 9.2.1.2.3Driving Capacitive Loads
        3. 9.2.1.3Application Curves
      2. 9.2.2Fully Differential Operation
      3. 9.2.3Single Supply Operation
      4. 9.2.4Driving Analog-to-Digital Converters
      5. 9.2.5Output Noise Performance and Measurement
      6. 9.2.6Balanced Cable Driver
  10. 10Power Supply Recommendations
    1. 10.1Power Supply Bypassing
  11. 11Layout
    1. 11.1Layout Guidelines
    2. 11.2Layout Example
    3. 11.3Power Dissipation
    4. 11.4ESD Protection
  12. 12Device and Documentation Support
    1. 12.1Device Support
      1. 12.1.1Third-Party Products Disclaimer
    2. 12.2Documentation Support
      1. 12.2.1Related Documentation
    3. 12.3Trademarks
    4. 12.4Electrostatic Discharge Caution
    5. 12.5Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings (1)(2)(4)

MINMAXUNIT
Supply Voltage (VS = V+ - V)5.5V
Common Mode Input VoltageV-V+V
Maximum Operating Junction Temperature150°C
Maximum Input Current 30mA
Maximum Output Current (pins 12, 13) (3)mA
Soldering Information260°C
Infrared or Convection (30 sec)
Storage Temperature, Tstg−65150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics: +5 V tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) The maximum output current (IOUT) is determined by device power dissipation limitations. See Power Dissipation for more details.
(4) For soldering specifications, see SNOA549.

7.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±750
Machine model (MM)±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

See (1)
MINNOMMAXUNIT
Operating Temperature Range −40 +125°C
Total Supply Voltage Temperature Range 4.75.25 V

7.4 Thermal Information

THERMAL METRIC(1)LMH6554UNIT
NHJ
14 PINS
RθJAJunction-to-ambient thermal resistance 60°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics: +5 V

Unless otherwise specified, all limits are ensured for TA = +25°C, AV = +2, V+ = +2.5 V, V− = −2.5 V, RL = 200 Ω, VCM = (V++V-)/2, RF = 200 Ω, for single-ended in, differential out.(1)
PARAMETERTEST CONDITIONSMIN (4)TYP (3)MAX (4)UNIT
AC PERFORMANCE (DIFFERENTIAL)
SSBWSmall Signal −3 dB Bandwidth (4)AV = 1, VOUT = 0.2 VPP2800MHz
AV = 2, VOUT = 0.2 VPP2500
AV = 4, VOUT = 0.2 VPP1600
LSBWLarge Signal Bandwidth AV = 1, VOUT = 2 VPP1800MHz
AV = 2, VOUT = 2 VPP1500
AV = 2, VOUT = 1.5 VPP1900
0.1 dBBW0.1 dB BandwidthAV = 2, VOUT = 0.2 VPP, RF = 250Ω830MHz
SRSlew Rate4V Step6200V/μs
tr/tfRise/Fall Time2V Step, 10–90%290ps
0.4V Step, 10–90%150
Ts_0.10.1% Settling Time2V Step, RL = 200Ω4ns
Overdrive Recovery TimeVIN = 2V, AV = 5 V/V6ns
DISTORTION AND NOISE RESPONSE
HD22nd Harmonic DistortionVOUT = 2 VPP, f = 20 MHz-102dBc
VOUT = 2 VPP, f = 75 MHz-96
VOUT = 2 VPP, f = 125 MHz-87
VOUT = 2 VPP, f = 250 MHz−79
VOUT = 1.5 VPP, f = 250 MHz−81
HD33rd Harmonic DistortionVOUT = 2 VPP, f = 20 MHz−110dBc
VOUT = 2 VPP, f = 75 MHz−97
VOUT = 2 VPP, f = 125 MHz−87
VOUT = 2 VPP, f = 250 MHz−70
VOUT = 1.5 VPP, f = 250 MHz−75
OIP3Output 3rd-Order Interceptf = 150 MHz, VOUT = 2VPP Composite46.5dBm
IMD3Two-Tone Intermodulationf = 150 MHz, VOUT = 2VPP Composite−97dBc
enInput Voltage Noise Densityf = 10 MHz 0.9nV/√Hz
in+Input Noise Currentf = 10 MHz 11pA/√Hz
in-Input Noise Currentf = 10 MHz11pA/√Hz
NFNoise Figure (8)50Ω System, AV = 7.3, 100 MHz7.7dB
INPUT CHARACTERISTICS
IBI+ / IBI-−75−2920µA
TCIbiInput Bias Current Temperature Drift8µA/°C
IBIDInput Bias Current (6)VCM = 0V, VID = 0V,
IBOFFSET = (IB- - IB+)/2
−10110μA
TCIboInput Bias Current Diff Offset Temperature Drift (3)0.006µA/°C
CMRRCommon Mode Rejection Ratio DC, VCM = 0V, VID = 0V83dB
RINDifferential Input ResistanceDifferential19Ω
CINDifferential Input CapacitanceDifferential1pF
CMVRInput Common Mode Voltage RangeCMRR > 32 dB±1.25±1.3V
OUTPUT PERFORMANCE
Output Voltage Swing (3)Single-Ended Output±1.35±1.42V
IOUTOutput Current (3)VOUT = 0V±120±150mA
ISCShort Circuit CurrentOne Output Shorted to Ground
VIN = 2V Single-Ended (2)
150mA
Output Balance ErrorΔVOUT Common Mode /ΔVOUT Differential, ΔVOD = 1V, f < 1 Mhz−64dB
OUTPUT COMMON MODE CONTROL CIRCUIT
Common Mode Small Signal BandwidthVIN+ = VIN = 0V500MHz
Slew RateVIN+ = VIN = 0V200V/μs
VOSCMInput Offset VoltageCommon Mode, VID = 0, VCM = 0V−16−6.54mV
IOSCMInput Offset Current (5)618μA
Voltage Range±1.18±1.25V
CMRRMeasure VOD, VID = 0V82dB
Input Resistance180
GainΔVOCM/ΔVCM0.990.9951.0V/V
MISCELLANEOUS PERFORMANCE
ZTOpen Loop Transimpedance GainDifferential180
PSRRPower Supply Rejection RatioDC, ΔV+ = ΔV = 1V7495dB
ISSupply Current (3)RL = ∞465257 mA
At extreme temperatures60
Enable Voltage ThresholdSingle 5V Supply (7)2.5V
Disable Voltage ThresholdSingle 5V Supply (7)2.5V
Enable/Disable Time15ns
ISDSupply Current, DisabledEnable=0, Single 5-V supply450510570 μA
At extreme temperatures600
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Thermal Information for information on temperature de-rating of this device." Min/Max ratings are based on product characterization and simulation. Individual parameters are tested as noted.
(2) Short circuit current should be limited in duration to no more than 10 seconds. See Power Dissipation for more details.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.
(4) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods.
(5) Negative input current implies current flowing out of the device.
(6) IBI is referred to a differential output offset voltage by the following relationship: VOD(OFFSET) = IBI*2RF.
(7) VEN threshold is typically +/-0.3V centered around (V+ + V-) / 2 relative to ground.
(8) For test schematic, refer to Figure 34.

7.6 Typical Performance Characteristics VS = ±2.5 V

(TA = 25°C, RF = 200 Ω, RG = 90 Ω, RT = 76.8 Ω, RL = 200 Ω, AV = +2, for single ended in, differential out, unless specified).
30073251.gifFigure 1. Frequency Response vs RF
30073252.gifFigure 3. Frequency Response vs RL
30073253.gifFigure 5. 0.5 VPP Pulse Response Single-Ended Input
30073255.gifFigure 7. 4 VPP Pulse Response Single-Ended Input
30073233.gifFigure 9. Distortion vs Output Common Mode Voltage
30073235.gifFigure 11. Distortion vs Output Common Mode Voltage
30073249.gifFigure 13. OIP3 vs Output Power POUT
30073268.gifFigure 15. Noise Figure vs Frequency
30073237.gifFigure 17. Minimum VOUT vs IOUT
30073241.gifFigure 19. PSRR
30073243.gifFigure 21. Balance Error
30073297.gifFigure 23. Closed-Loop Output Impedance
30073211.gifFigure 2. Frequency Response vs Gain
30073213.gifFigure 4. Frequency Response vs Output Voltage (VOD)
30073254.gifFigure 6. 2 VPP Pulse Response Single-Ended Input
30073228.gifFigure 8. Distortion vs Frequency Single-Ended Input
30073234.gifFigure 10. Distortion vs Output Common Mode Voltage
30073248.gifFigure 12. 3rd Order Intermodulation Products vs VOUT
30073250.gifFigure 14. OIP3 vs Center Frequency
30073236.gifFigure 16. Maximum VOUT vs IOUT
30073240.gifFigure 18. Overdrive Recovery
30073242.gifFigure 20. CMRR
30073269.gifFigure 22. Open Loop Transimpedance
30073246.gifFigure 24. Differential S-Parameter Magnitude vs Frequency