SLAS734G April 2011  – April 2016 MSP430G2203 , MSP430G2233 , MSP430G2303 , MSP430G2333 , MSP430G2403 , MSP430G2433 , MSP430G2533

PRODUCTION DATA. 

  1. 1Device Overview
    1. 1.1Features
    2. 1.2Applications
    3. 1.3Description
    4. 1.4Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1Pin Diagrams
    2. 4.2Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5 Typical Characteristics, Active Mode Supply Current (Into VCC)
    6. 5.6 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    7. 5.7 Typical Characteristics, Low-Power Mode Supply Currents
    8. 5.8 Thermal Resistance Characteristics
    9. 5.9 Schmitt-Trigger Inputs, Ports Px
    10. 5.10Leakage Current, Ports Px
    11. 5.11Outputs, Ports Px
    12. 5.12Output Frequency, Ports Px
    13. 5.13Typical Characteristics - Outputs
    14. 5.14Pin-Oscillator Frequency - Ports Px
    15. 5.15Typical Characteristics - Pin-Oscillator Frequency
    16. 5.16POR, BOR
    17. 5.17Main DCO Characteristics
    18. 5.18DCO Frequency
    19. 5.19Calibrated DCO Frequencies, Tolerance
    20. 5.20Wake-up Times From Lower-Power Modes (LPM3, LPM4)
    21. 5.21Typical Characteristics, DCO Clock Wake-up Time From LPM3 or LPM4
    22. 5.22Crystal Oscillator, XT1, Low-Frequency Mode
    23. 5.23Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    24. 5.24Timer_A
    25. 5.25USCI (UART Mode)
    26. 5.26USCI (SPI Master Mode)
    27. 5.27USCI (SPI Slave Mode)
    28. 5.28USCI (I2C Mode)
    29. 5.2910-Bit ADC, Power Supply and Input Range Conditions (MSP430G2x33 Only)
    30. 5.3010-Bit ADC, Built-In Voltage Reference (MSP430G2x33 Only)
    31. 5.3110-Bit ADC, External Reference (MSP430G2x33 Only)
    32. 5.3210-Bit ADC, Timing Parameters (MSP430G2x33 Only)
    33. 5.3310-Bit ADC, Linearity Parameters (MSP430G2x33 Only)
    34. 5.3410-Bit ADC, Temperature Sensor and Built-In VMID (MSP430G2x33 Only)
    35. 5.35Flash Memory
    36. 5.36RAM
    37. 5.37JTAG and Spy-Bi-Wire Interface
    38. 5.38JTAG Fuse
  6. 6Detailed Description
    1. 6.1 CPU
    2. 6.2 Instruction Set
    3. 6.3 Operating Modes
    4. 6.4 Interrupt Vector Addresses
    5. 6.5 Special Function Registers (SFRs)
    6. 6.6 Memory Organization
    7. 6.7 Bootloader (BSL)
    8. 6.8 Flash Memory
    9. 6.9 Peripherals
      1. 6.9.1Oscillator and System Clock
      2. 6.9.2Calibration Data Stored in Information Memory Segment A
      3. 6.9.3Brownout
      4. 6.9.4Digital I/O
      5. 6.9.5WDT+ Watchdog Timer
      6. 6.9.6Timer_A3 (TA0, TA1)
      7. 6.9.7Universal Serial Communications Interface (USCI)
      8. 6.9.8ADC10 (MSP430G2x33 Only)
      9. 6.9.9Peripheral File Map
    10. 6.10I/O Port Diagrams
      1. 6.10.1Port P1 Pin Diagram: P1.0 to P1.2, Input/Output With Schmitt Trigger
      2. 6.10.2Port P1 Pin Diagram: P1.3, Input/Output With Schmitt Trigger
      3. 6.10.3Port P1 Pin Diagram: P1.4, Input/Output With Schmitt Trigger
      4. 6.10.4Port P1 Pin Diagram: P1.5 to P1.7, Input/Output With Schmitt Trigger
      5. 6.10.5Port P2 Pin Diagram: P2.0 to P2.5, Input/Output With Schmitt Trigger
      6. 6.10.6Port P2 Pin Diagram: P2.6, Input/Output With Schmitt Trigger
      7. 6.10.7Port P2 Pin Diagram: P2.7, Input/Output With Schmitt Trigger
      8. 6.10.8Port P3 Pin Diagram: P3.0 to P3.7, Input/Output With Schmitt Trigger (RHB and PW28 Package Only)
  7. 7Device and Documentation Support
    1. 7.1Getting Started and Next Steps
    2. 7.2Device Nomenclature
    3. 7.3Tools and Software
    4. 7.4Documentation Support
    5. 7.5Related Links
    6. 7.6Community Resources
    7. 7.7Trademarks
    8. 7.8Electrostatic Discharge Caution
    9. 7.9Glossary
  8. 8Mechanical, Packaging, and Orderable Information

2 Revision History

Changes from May 2, 2013 to April 27, 2016

  • Document format and organization changes throughout, including addition of section numberingGo
  • Added Device Information tableGo
  • Added Section 3.1, Related Products Go
  • Moved Section 5, SpecificationsGo
  • Added Section 5.2, ESD RatingsGo
  • Added Section 5.8, Thermal Resistance CharacteristicsGo
  • Throughout document, changed all instances of "bootstrap loader" to "bootloader"Go
  • Changed all instances of "INCHx = 0x1010" to "INCHx = 1010b" in Table 6-11, Labels Used by the ADC Calibration TagsGo
  • Moved and renamed Section 6.10, I/O Port DiagramsGo
  • Added notes to UCB0STE and UCA0CLK in Table 6-18Go
  • Added notes to UCB0CLK and UCA0STE in Table 6-19Go
  • Added "and PW28" to title of Section 6.10.8Go
  • Added "and PW28" to title of Table 6-23Go
  • Added Section 7, Device and Documentation SupportGo
  • Added Section 8, Mechanical, Packaging, and Orderable InformationGo